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Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation

The electronic industries are changing the solder used from the lead solder to the lead-free solder. The elimination of lead solder is done due to the new laws and restrictions. The lead-free solder is extensively used in the electronic assemblies and there is also concerns about the lead-free solde...

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Main Author: Zahit, Mohd Amier Hasief Mat
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2017
Subjects:
T Technology
TJ1 Mechanical engineering and machinery
Online Access:http://eprints.usm.my/54408/1/Structural%20Integrity%20Study%20Of%20Ultra-Fine%20Solder%20Joint%20Using%20Microscopy%20Investigation_Mohd%20Amier%20Hasief%20%20Mat%20Zahit_M4_2017.pdf
http://eprints.usm.my/54408/
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spelling my.usm.eprints.54408 http://eprints.usm.my/54408/ Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation Zahit, Mohd Amier Hasief Mat T Technology TJ1 Mechanical engineering and machinery The electronic industries are changing the solder used from the lead solder to the lead-free solder. The elimination of lead solder is done due to the new laws and restrictions. The lead-free solder is extensively used in the electronic assemblies and there is also concerns about the lead-free solder reliability. Solder joints in electronic products are used as interconnection material for enabling electrical, thermal and mechanical function in the electronic packaging. Addition of nano particles in the solder joint is to investigate the relation between the percentage and the quality of the solder joint. The quality of the solder joints is one of the most important aspect that we need to consider to make a good solder joint. The hardness test of the solder joint is to know what is the relation between hardness and the percentage of the nano particles in solder joint. Three types of solder joints that contain 0.01%, 0.05%, and 0.15% of Fe2O3 (Feric Oxide) are used in the experiment with small (01005), medium (0603) and big (0805) size of the component. Universiti Sains Malaysia 2017-06-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/54408/1/Structural%20Integrity%20Study%20Of%20Ultra-Fine%20Solder%20Joint%20Using%20Microscopy%20Investigation_Mohd%20Amier%20Hasief%20%20Mat%20Zahit_M4_2017.pdf Zahit, Mohd Amier Hasief Mat (2017) Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanik. (Submitted)
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic T Technology
TJ1 Mechanical engineering and machinery
spellingShingle T Technology
TJ1 Mechanical engineering and machinery
Zahit, Mohd Amier Hasief Mat
Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation
description The electronic industries are changing the solder used from the lead solder to the lead-free solder. The elimination of lead solder is done due to the new laws and restrictions. The lead-free solder is extensively used in the electronic assemblies and there is also concerns about the lead-free solder reliability. Solder joints in electronic products are used as interconnection material for enabling electrical, thermal and mechanical function in the electronic packaging. Addition of nano particles in the solder joint is to investigate the relation between the percentage and the quality of the solder joint. The quality of the solder joints is one of the most important aspect that we need to consider to make a good solder joint. The hardness test of the solder joint is to know what is the relation between hardness and the percentage of the nano particles in solder joint. Three types of solder joints that contain 0.01%, 0.05%, and 0.15% of Fe2O3 (Feric Oxide) are used in the experiment with small (01005), medium (0603) and big (0805) size of the component.
format Monograph
author Zahit, Mohd Amier Hasief Mat
author_facet Zahit, Mohd Amier Hasief Mat
author_sort Zahit, Mohd Amier Hasief Mat
title Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation
title_short Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation
title_full Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation
title_fullStr Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation
title_full_unstemmed Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation
title_sort structural integrity study of ultra-fine solder joint using microscopy investigation
publisher Universiti Sains Malaysia
publishDate 2017
url http://eprints.usm.my/54408/1/Structural%20Integrity%20Study%20Of%20Ultra-Fine%20Solder%20Joint%20Using%20Microscopy%20Investigation_Mohd%20Amier%20Hasief%20%20Mat%20Zahit_M4_2017.pdf
http://eprints.usm.my/54408/
_version_ 1743107826298912768
score 13.211869

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