Structural Integrity Study Of Ultra-Fine Solder Joint Using Microscopy Investigation
The electronic industries are changing the solder used from the lead solder to the lead-free solder. The elimination of lead solder is done due to the new laws and restrictions. The lead-free solder is extensively used in the electronic assemblies and there is also concerns about the lead-free solde...
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2017
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| Online Access: | http://eprints.usm.my/54408/1/Structural%20Integrity%20Study%20Of%20Ultra-Fine%20Solder%20Joint%20Using%20Microscopy%20Investigation_Mohd%20Amier%20Hasief%20%20Mat%20Zahit_M4_2017.pdf http://eprints.usm.my/54408/ |
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