Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field
NiFe films were pulse electrodeposited on conductive copper substrates under galvanostatic mode with and without the presence of an ultrasonic field at different pulse current magnitudes and duty cycles. The optimum deposition condition was found to be at a current magnitude of 40 mA and a duty cycl...
Saved in:
Main Authors: | Ruthramurthy, Balachandran, Yow, Ho Kwang, Ong, Boon Hoong, Tan, Kar Ban, Kassim, Anuar, Wong, Hin Yong |
---|---|
Format: | Article |
Language: | English |
Published: |
Electrochemical Science Group
2011
|
Online Access: | http://psasir.upm.edu.my/id/eprint/24904/1/Surface%20morphology%20and%20electrical%20properties%20of%20pulse%20electrodeposition%20of%20NiFe%20films%20on%20copper%20substrates%20in%20ultrasonic%20field.pdf http://psasir.upm.edu.my/id/eprint/24904/ http://www.electrochemsci.org/list11.htm#issue8 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Effects of ultrasonic field in pulse electrodeposition of NiFe film on Cu substrate.
by: Balachandran, R., et al.
Published: (2009) -
Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition
by: Kakumani, Asa Deepthi, et al.
Published: (2016) -
Surface morphology of Ni-Fe thin films grown on copper substrates using pulse electrodeposition in ultrasonic field
by: Ruthramurthy, Balachandran, et al.
Published: (2008) -
Physical and electrical characteristics of NiFe thin films using ultrasonic assisted pulse electrodeposition
by: Asa Deepthi, K., et al.
Published: (2016) -
Structural and electrical properties of nickel–iron thin film on copper substrate for dynamic random access memory applications
by: Saeed, Ayad, et al.
Published: (2016)