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Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field

NiFe films were pulse electrodeposited on conductive copper substrates under galvanostatic mode with and without the presence of an ultrasonic field at different pulse current magnitudes and duty cycles. The optimum deposition condition was found to be at a current magnitude of 40 mA and a duty cycl...

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Main Authors: Ruthramurthy, Balachandran, Yow, Ho Kwang, Ong, Boon Hoong, Tan, Kar Ban, Kassim, Anuar, Wong, Hin Yong
Format: Article
Language:English
Published: Electrochemical Science Group 2011
Online Access:http://psasir.upm.edu.my/id/eprint/24904/1/Surface%20morphology%20and%20electrical%20properties%20of%20pulse%20electrodeposition%20of%20NiFe%20films%20on%20copper%20substrates%20in%20ultrasonic%20field.pdf
http://psasir.upm.edu.my/id/eprint/24904/
http://www.electrochemsci.org/list11.htm#issue8
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spelling my.upm.eprints.249042019-06-13T03:27:09Z http://psasir.upm.edu.my/id/eprint/24904/ Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field Ruthramurthy, Balachandran Yow, Ho Kwang Ong, Boon Hoong Tan, Kar Ban Kassim, Anuar Wong, Hin Yong NiFe films were pulse electrodeposited on conductive copper substrates under galvanostatic mode with and without the presence of an ultrasonic field at different pulse current magnitudes and duty cycles. The optimum deposition condition was found to be at a current magnitude of 40 mA and a duty cycle of 50.00% under ultrasonic treatment. This deposition condition has significantly reduced the surface roughness from 39.01 ±1.1 nm to 6.96 ±1.1 nm and the spherical grain size in the range from 579.40 nm - 623.30 nm to 29.00 nm - 46.90 nm. On the other hand, the resistivity was reduced to 19.86 µωcm from 54.00 µωcm as the Ni content increased from 76.08% to 80.12 % for achieving good stoichiometry for NiFe thin films. Through the optimization study, the deposition current is observed to be the dominant factor in determining the single phase deposition of NiFe film whereas ultrasonic field and duty cycle significantly reduces the surface roughness and the spherical grain size, all of which combine to reduce film resistivity. Electrochemical Science Group 2011-08 Article PeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/24904/1/Surface%20morphology%20and%20electrical%20properties%20of%20pulse%20electrodeposition%20of%20NiFe%20films%20on%20copper%20substrates%20in%20ultrasonic%20field.pdf Ruthramurthy, Balachandran and Yow, Ho Kwang and Ong, Boon Hoong and Tan, Kar Ban and Kassim, Anuar and Wong, Hin Yong (2011) Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field. International Journal of Electrochemical Science, 6 (8). pp. 3564-3579. ISSN 1452-3981 http://www.electrochemsci.org/list11.htm#issue8
institution Universiti Putra Malaysia
building UPM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Putra Malaysia
content_source UPM Institutional Repository
url_provider http://psasir.upm.edu.my/
language English
description NiFe films were pulse electrodeposited on conductive copper substrates under galvanostatic mode with and without the presence of an ultrasonic field at different pulse current magnitudes and duty cycles. The optimum deposition condition was found to be at a current magnitude of 40 mA and a duty cycle of 50.00% under ultrasonic treatment. This deposition condition has significantly reduced the surface roughness from 39.01 ±1.1 nm to 6.96 ±1.1 nm and the spherical grain size in the range from 579.40 nm - 623.30 nm to 29.00 nm - 46.90 nm. On the other hand, the resistivity was reduced to 19.86 µωcm from 54.00 µωcm as the Ni content increased from 76.08% to 80.12 % for achieving good stoichiometry for NiFe thin films. Through the optimization study, the deposition current is observed to be the dominant factor in determining the single phase deposition of NiFe film whereas ultrasonic field and duty cycle significantly reduces the surface roughness and the spherical grain size, all of which combine to reduce film resistivity.
format Article
author Ruthramurthy, Balachandran
Yow, Ho Kwang
Ong, Boon Hoong
Tan, Kar Ban
Kassim, Anuar
Wong, Hin Yong
spellingShingle Ruthramurthy, Balachandran
Yow, Ho Kwang
Ong, Boon Hoong
Tan, Kar Ban
Kassim, Anuar
Wong, Hin Yong
Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field
author_facet Ruthramurthy, Balachandran
Yow, Ho Kwang
Ong, Boon Hoong
Tan, Kar Ban
Kassim, Anuar
Wong, Hin Yong
author_sort Ruthramurthy, Balachandran
title Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field
title_short Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field
title_full Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field
title_fullStr Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field
title_full_unstemmed Surface morphology and electrical properties of pulse electrodeposition of NiFe films on copper substrates in ultrasonic field
title_sort surface morphology and electrical properties of pulse electrodeposition of nife films on copper substrates in ultrasonic field
publisher Electrochemical Science Group
publishDate 2011
url http://psasir.upm.edu.my/id/eprint/24904/1/Surface%20morphology%20and%20electrical%20properties%20of%20pulse%20electrodeposition%20of%20NiFe%20films%20on%20copper%20substrates%20in%20ultrasonic%20field.pdf
http://psasir.upm.edu.my/id/eprint/24904/
http://www.electrochemsci.org/list11.htm#issue8
_version_ 1643828499707854848
score 13.211869

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