Investigating the structural transformation of individual Au-incorporated carbon nanofiber interconnect
Nowadays, a smaller electronic integrated circuit demands a smaller width and pitch of interconnect. Copper (Cu) interconnect, which is currently the most common, suffers from the size effect and grain boundary scattering. Hence, carbon materials such as carbon nanotubes (CNTs) and carbon nanofiber...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Published: |
Universiti Putra Malaysia
2022
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| Online Access: | http://psasir.upm.edu.my/id/eprint/101980/ https://malaysianjournalofmicroscopy.org/ojs/index.php/mjm/article/view/621 |
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