Microstructure study of lead free solders in electroless nickel gold under bump metallurgy solder bump
In electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) solder bump system, the nickel UBM and solder deposition aspects, are two of the most important factors affecting the stability of solder joints. In this study solder bump shearing strength, materials interaction and inter-metal...
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| Main Authors: | , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5322 |
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