Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping
Thin wafers of 100-μm thickness laminated with die-attach film (DAF) was diced using a standard sawing process and revealed a low chipping crack resistance. Wafers laminated with conductive DAF shows greater chipping compared to nonconductive DAF and bare silicon wafer. It was found through scanning...
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| Main Authors: | , , , |
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5321 |
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