Wafer dicing vibration investigation on novel wafer mounting techniques
Chipping has emerged as a significant issue in semiconductor manufacturing, particularly during the dicing process. The existing conventional single-sided wafer mounting technique does not have sufficient holding capability which contributes to instability during dicing and causes higher chipping pe...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Institute Of Electrical And Electronics Engineers Inc.
2024
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| Online Access: | http://eprints.utem.edu.my/id/eprint/28378/2/02137301220241552241556.pdf http://eprints.utem.edu.my/id/eprint/28378/ https://ieeexplore.ieee.org/document/10614291 https://ieeexplore.ieee.org/document/10614291?source=authoralert |
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