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A study on inter-metallic compound formation and structure of lead free SnAgCu solder system

This paper characterizes the effect of various Sn-Ag-Cu solder compositions towards shear strength and melting behavior. Shear strength is measured by Dage which is representative of the inter-metallic compound (IMC) strength between the solder and solder clad of a C5 bump. Further study on melting...

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Bibliographic Details
Main Authors:	Ahmad, I., Jiun, H.H., Leng, E.P., Majlis, B.Y., Jalar, A., Wagiran, R.
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Published:	2017
Online Access:	http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5315
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