Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer
This paper discusses sputtered silicon encapsulation as a wafer level packaging approach for isolatable MEMS devices. Devices such as accelerometers, RF switches, inductors, and filters that do not require interaction with the surroundings to function, could thus be fully encapsulated at the wafer l...
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| 主要な著者: | , , , |
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| 出版事項: |
2017
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| オンライン･アクセス: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5281 |
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