Cover Image

Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC t...

Full description

Saved in:
Bibliographic Details
Main Authors: Shualdi, W., Bais, B., Ahmad, I., Omar, G., Isnin, A.
Format:
Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5234
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.uniten.dspace-5234
record_format dspace
spelling my.uniten.dspace-52342017-11-15T02:56:53Z Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging Shualdi, W. Bais, B. Ahmad, I. Omar, G. Isnin, A. Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC to ensure the reliability of the solder joints. In this paper, a nanoindentation test was performed at IMCs that grow on the interface between Sn-Ag-Sb lead-free solder alloy and its Cu substrate. The test was done from planar IMC surface. Prior of that, the specimens were subjected to thermal aging process until 1500 hours at 175°C to accelerate the growth of IMC. The nanotest was executed on specimens with completed aging time for 100, 200, 400, 800 and 1500 hours. Nanoindentation results in this paper show the hardness and Young modulus of IMC composition as a whole, without interpretation of hardness properties of Cu3Sn and Cu6Sn5 individually. The hardness of Sn-Ag-Sb/Cu Substrate IMC Layer is decreasing from 5.583 GPa to4.444 GPa while the Young modulus is decreasing from 106.475 GPa to 128.439 GPa. © 2011 IEEE. 2017-11-15T02:56:53Z 2017-11-15T02:56:53Z 2011 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5234
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC to ensure the reliability of the solder joints. In this paper, a nanoindentation test was performed at IMCs that grow on the interface between Sn-Ag-Sb lead-free solder alloy and its Cu substrate. The test was done from planar IMC surface. Prior of that, the specimens were subjected to thermal aging process until 1500 hours at 175°C to accelerate the growth of IMC. The nanotest was executed on specimens with completed aging time for 100, 200, 400, 800 and 1500 hours. Nanoindentation results in this paper show the hardness and Young modulus of IMC composition as a whole, without interpretation of hardness properties of Cu3Sn and Cu6Sn5 individually. The hardness of Sn-Ag-Sb/Cu Substrate IMC Layer is decreasing from 5.583 GPa to4.444 GPa while the Young modulus is decreasing from 106.475 GPa to 128.439 GPa. © 2011 IEEE.
format
author Shualdi, W.
Bais, B.
Ahmad, I.
Omar, G.
Isnin, A.
spellingShingle Shualdi, W.
Bais, B.
Ahmad, I.
Omar, G.
Isnin, A.
Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging
author_facet Shualdi, W.
Bais, B.
Ahmad, I.
Omar, G.
Isnin, A.
author_sort Shualdi, W.
title Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging
title_short Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging
title_full Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging
title_fullStr Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging
title_full_unstemmed Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging
title_sort nanoindentation characterization of sn-ag-sb/cu substrate imc layer subject to thermal aging
publishDate 2017
url http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5234
_version_ 1644493623421566976
score 13.211869

Similar Items