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Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates

Reflow soldering process is one of the important steps in the manufacturing process for ball grid arrays. The purpose of this study is to observe the metallurgical bonding between Sn3.5Ag solder ball and electroless nickel immersion gold (ENIG) substrates after reflow soldering process. The reflow s...

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Main Authors: Muhammad, N.A., Bais, B.H., Ahmad, I., Isnin, A.
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Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5231
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spelling my.uniten.dspace-52312017-11-15T02:56:50Z Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates Muhammad, N.A. Bais, B.H. Ahmad, I. Isnin, A. Reflow soldering process is one of the important steps in the manufacturing process for ball grid arrays. The purpose of this study is to observe the metallurgical bonding between Sn3.5Ag solder ball and electroless nickel immersion gold (ENIG) substrates after reflow soldering process. The reflow soldering process was performed at peak temperatures T peak of 246 and 251°C for 50 s by the rapid thermal processing system. Visual micrographs of these solder joints were performed in order to support the metallurgical bonding of Sn3.5Ag solder ball and ENIG substrate after the reflow soldering process. The formation of Ni 3Sn 4 intermetallic compounds (IMCs) at the Sn3.5Ag solder/Ni interface was dependent and continuous with one another compared to the initial IMC formation at Tpeak of ̃246°C. It was also found that the initial IMCs thickness of Sn3.5Ag solder/Ni interface was lower and thinner at Tpeak of y251uC during the reflow soldering process. As a conclusion, the metallurgical bonding between Sn3?5Ag solder/ENIG substrate was formed better at T peak of ̃251°C during the reflow soldering process using the rapid thermal processing system. © W. S. Maney & Son Ltd. 2011. 2017-11-15T02:56:50Z 2017-11-15T02:56:50Z 2011 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5231
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description Reflow soldering process is one of the important steps in the manufacturing process for ball grid arrays. The purpose of this study is to observe the metallurgical bonding between Sn3.5Ag solder ball and electroless nickel immersion gold (ENIG) substrates after reflow soldering process. The reflow soldering process was performed at peak temperatures T peak of 246 and 251°C for 50 s by the rapid thermal processing system. Visual micrographs of these solder joints were performed in order to support the metallurgical bonding of Sn3.5Ag solder ball and ENIG substrate after the reflow soldering process. The formation of Ni 3Sn 4 intermetallic compounds (IMCs) at the Sn3.5Ag solder/Ni interface was dependent and continuous with one another compared to the initial IMC formation at Tpeak of ̃246°C. It was also found that the initial IMCs thickness of Sn3.5Ag solder/Ni interface was lower and thinner at Tpeak of y251uC during the reflow soldering process. As a conclusion, the metallurgical bonding between Sn3?5Ag solder/ENIG substrate was formed better at T peak of ̃251°C during the reflow soldering process using the rapid thermal processing system. © W. S. Maney & Son Ltd. 2011.
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author Muhammad, N.A.
Bais, B.H.
Ahmad, I.
Isnin, A.
spellingShingle Muhammad, N.A.
Bais, B.H.
Ahmad, I.
Isnin, A.
Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates
author_facet Muhammad, N.A.
Bais, B.H.
Ahmad, I.
Isnin, A.
author_sort Muhammad, N.A.
title Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates
title_short Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates
title_full Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates
title_fullStr Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates
title_full_unstemmed Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates
title_sort effect of reflow soldering process on metallurgical bonding between sn3.5ag solder and enig substrates
publishDate 2017
url http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5231
_version_ 1644493622550200320
score 13.222552

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