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Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system

A study on reflow soldering process for Sn3.5Ag solder on ENIG substrate was performed using the rapid thermal processing (RTP) system. The reflow soldering process by RTP system can be successful, but it is sensitive to some typical defects. A poor RTP system design can lead to significant temperat...

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Main Authors: Adhila Muhammad, N., Bais, B., Ahmad, I.
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Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5208
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spelling my.uniten.dspace-52082017-11-15T02:56:37Z Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system Adhila Muhammad, N. Bais, B. Ahmad, I. A study on reflow soldering process for Sn3.5Ag solder on ENIG substrate was performed using the rapid thermal processing (RTP) system. The reflow soldering process by RTP system can be successful, but it is sensitive to some typical defects. A poor RTP system design can lead to significant temperature differences where non-uniform heating or cooling may result in material failure due to increase in thermal stresses or serious damage. From this study, it was found that at a peak temperature (Tpeak) of 251°C, the reflowed solder was observed to be smooth joint appearance over the solder pad and formed a regular joint shape of the solder due to the efficient reflow profile and sufficient heating input during the reflow process. The Ni3Sn4 intermetallic compounds were found to be continuous, thus resulting in a good metallurgical bonding between Sn3.5Ag solder and ENIG substrate. Meanwhile, an uneven reflowed solder and defect mechanism was detected at Tpeak of 246 and 260°C. This is due to the inadequate reflow profile and insufficient heating input during the reflow soldering process in the RTP system. Visual micrographs of reflowed solder and cross-sectional micrograph and elemental analysis were presented in this paper for better understanding of the defect mechanism in order to optimize the reflow soldering process using RTP system. The reflow soldering process can be performed better with appropriate reflow profile in the RTP system in order to achieve a good solder joint of Sn3.5Ag solder and ENIG substrate. © Copyright Reserved 2007 Sains Malaysiana. 2017-11-15T02:56:37Z 2017-11-15T02:56:37Z 2014 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5208
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description A study on reflow soldering process for Sn3.5Ag solder on ENIG substrate was performed using the rapid thermal processing (RTP) system. The reflow soldering process by RTP system can be successful, but it is sensitive to some typical defects. A poor RTP system design can lead to significant temperature differences where non-uniform heating or cooling may result in material failure due to increase in thermal stresses or serious damage. From this study, it was found that at a peak temperature (Tpeak) of 251°C, the reflowed solder was observed to be smooth joint appearance over the solder pad and formed a regular joint shape of the solder due to the efficient reflow profile and sufficient heating input during the reflow process. The Ni3Sn4 intermetallic compounds were found to be continuous, thus resulting in a good metallurgical bonding between Sn3.5Ag solder and ENIG substrate. Meanwhile, an uneven reflowed solder and defect mechanism was detected at Tpeak of 246 and 260°C. This is due to the inadequate reflow profile and insufficient heating input during the reflow soldering process in the RTP system. Visual micrographs of reflowed solder and cross-sectional micrograph and elemental analysis were presented in this paper for better understanding of the defect mechanism in order to optimize the reflow soldering process using RTP system. The reflow soldering process can be performed better with appropriate reflow profile in the RTP system in order to achieve a good solder joint of Sn3.5Ag solder and ENIG substrate. © Copyright Reserved 2007 Sains Malaysiana.
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author Adhila Muhammad, N.
Bais, B.
Ahmad, I.
spellingShingle Adhila Muhammad, N.
Bais, B.
Ahmad, I.
Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
author_facet Adhila Muhammad, N.
Bais, B.
Ahmad, I.
author_sort Adhila Muhammad, N.
title Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
title_short Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
title_full Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
title_fullStr Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
title_full_unstemmed Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
title_sort reflow soldering process for sn3.5ag solder on enig using rapid thermal processing system
publishDate 2017
url http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5208
_version_ 1644493615385280512
score 13.222552

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