Analysis of Transmission Performance for Fine Pitch Interconnect
Wire bonding is the preferred interconnection in the IC packaging. Understanding the electrical performance of bonding wire as transmission line is utmost important. To date, there are very limited studies on the transmission performance of fine pitch bare bonding wire especially the insulated wires...
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| Main Authors: | , , , , |
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| Format: | Book chapter |
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Trans Tech Publications Ltd
2024
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