Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology
Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology...
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my.uniten.dspace-299732023-12-29T15:43:48Z Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology Kar Y.B. Talik N.A. Sauli Z. Seng F.C. Yong T.C. Retnasamy V. 26649255900 55576358000 24554644300 26432892000 16029485400 24802373600 Contamination Decontamination Flip chip Flux cleaning Ionic contaminations Solvents Water-based solvent Chromatographic analysis Contamination Solvents Contamination levels Design/methodology/approach Environmental-friendly Flip chip Flip chip ball grid array Ionic contamination Long term performance Water based Decontamination Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology/approach - Thus, the flux-cleaning process was implemented and the cleanliness effect was evaluated. Cleaning experiments using a new water-based solvent were carried out to investigate the flux-cleaning efficiency. The test packages were then evaluated via ion chromatography (IC). Findings - Ion chromatograms show that there are high levels of ionic elements detected prior to the cleaning process. After the cleaning process, the contamination levels reduced significantly. Originality/value - The value of the work here is testing of the new environmental friendly water-based MPC cleaning efficiency. The reduction of ionic contamination is thus reported. � Copyright - 2013 Emerald Group Publishing Limited. All rights reserved. Final 2023-12-29T07:43:48Z 2023-12-29T07:43:48Z 2013 Article 10.1108/13565361311314502 2-s2.0-84882402335 https://www.scopus.com/inward/record.uri?eid=2-s2.0-84882402335&doi=10.1108%2f13565361311314502&partnerID=40&md5=8cb2e53c76b7e17d3b9688fd51c61165 https://irepository.uniten.edu.my/handle/123456789/29973 30 2 17086474 99 103 Scopus |
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Contamination Decontamination Flip chip Flux cleaning Ionic contaminations Solvents Water-based solvent Chromatographic analysis Contamination Solvents Contamination levels Design/methodology/approach Environmental-friendly Flip chip Flip chip ball grid array Ionic contamination Long term performance Water based Decontamination |
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Contamination Decontamination Flip chip Flux cleaning Ionic contaminations Solvents Water-based solvent Chromatographic analysis Contamination Solvents Contamination levels Design/methodology/approach Environmental-friendly Flip chip Flip chip ball grid array Ionic contamination Long term performance Water based Decontamination Kar Y.B. Talik N.A. Sauli Z. Seng F.C. Yong T.C. Retnasamy V. Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| description |
Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the package long-term performance. Design/methodology/approach - Thus, the flux-cleaning process was implemented and the cleanliness effect was evaluated. Cleaning experiments using a new water-based solvent were carried out to investigate the flux-cleaning efficiency. The test packages were then evaluated via ion chromatography (IC). Findings - Ion chromatograms show that there are high levels of ionic elements detected prior to the cleaning process. After the cleaning process, the contamination levels reduced significantly. Originality/value - The value of the work here is testing of the new environmental friendly water-based MPC cleaning efficiency. The reduction of ionic contamination is thus reported. � Copyright - 2013 Emerald Group Publishing Limited. All rights reserved. |
| author2 |
26649255900 |
| author_facet |
26649255900 Kar Y.B. Talik N.A. Sauli Z. Seng F.C. Yong T.C. Retnasamy V. |
| format |
Article |
| author |
Kar Y.B. Talik N.A. Sauli Z. Seng F.C. Yong T.C. Retnasamy V. |
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Kar Y.B. |
| title |
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| title_short |
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| title_full |
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| title_fullStr |
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| title_full_unstemmed |
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology |
| title_sort |
ionic contaminations level and cleaning flip chip bga package via a new cleaning solvent technology |
| publishDate |
2023 |
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1806425681805967360 |
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13.222552 |