Review of Health Prognostics and Condition Monitoring of Electronic Components
Failure (mechanical); Green manufacturing; Network components; Reliability analysis; Electronic component; Failure mechanism; Fault diagnosis technique; Health prognostics; Intelligent tools; Reliable electronics; Remaining useful life predictions; Residual lifetime; Condition monitoring
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| 主要な著者: | , , , , , , , |
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| その他の著者: | |
| フォーマット: | 論文 |
| 出版事項: |
Institute of Electrical and Electronics Engineers Inc.
2023
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| 要約: | Failure (mechanical); Green manufacturing; Network components; Reliability analysis; Electronic component; Failure mechanism; Fault diagnosis technique; Health prognostics; Intelligent tools; Reliable electronics; Remaining useful life predictions; Residual lifetime; Condition monitoring |
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