APA引文

C., B., & 55641321100. (2023). Review of Health Prognostics and Condition Monitoring of Electronic Components. Institute of Electrical and Electronics Engineers Inc.

Chicago Style Citation

C., Bhargava, and 55641321100. Review of Health Prognostics and Condition Monitoring of Electronic Components. Institute of Electrical and Electronics Engineers Inc, 2023.

MLA引文

C., Bhargava, and 55641321100. Review of Health Prognostics and Condition Monitoring of Electronic Components. Institute of Electrical and Electronics Engineers Inc, 2023.