Role of alternating current shape on microstructure and damage evolution of solder joints
Degradation; Mechanical properties; AC currents; Alternating current; Degradation of mechanical properties; Electronic package; Electronic systems; Micro-structural characterization; Solder joints; Thermal fluctuations; Electric impedance measurement
Saved in:
| Main Authors: | , , , , |
|---|---|
| 其他作者: | |
| 格式: | Article |
| 出版: |
Elsevier Ltd
2023
|
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|