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Role of alternating current shape on microstructure and damage evolution of solder joints

Degradation; Mechanical properties; AC currents; Alternating current; Degradation of mechanical properties; Electronic package; Electronic systems; Micro-structural characterization; Solder joints; Thermal fluctuations; Electric impedance measurement

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Main Authors: Siswanto W.A., Krasnopevtsev A.Y., Talarpoushti G.F., Maseleno A., Kuzichkin O.R.
Other Authors: 42862458800
Format: Article
Published: Elsevier Ltd 2023
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id my.uniten.dspace-25588
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spelling my.uniten.dspace-255882023-05-29T16:11:20Z Role of alternating current shape on microstructure and damage evolution of solder joints Siswanto W.A. Krasnopevtsev A.Y. Talarpoushti G.F. Maseleno A. Kuzichkin O.R. 42862458800 37003766400 57212762726 55354910900 23982900700 Degradation; Mechanical properties; AC currents; Alternating current; Degradation of mechanical properties; Electronic package; Electronic systems; Micro-structural characterization; Solder joints; Thermal fluctuations; Electric impedance measurement Motivated by recent works indicating the role of AC current on the reliability of electronic systems, the microstructural characterization and mechanical properties of solder joints, as vulnerable parts of electronic packages, under different alternating current shapes were investigated. The sine-, square- and triangle-waveform currents were considered for the experiments. The simulation results showed that the triangle shape current creates the highest thermal fluctuations and stress variations in the solder joints. This event was due to the lack of any relaxation time at the critical states, induced by triangle shape current, which leads to the intensification of stress in the solder material. On the other side, the sine- and square- currents have time to relax stresses at their peak temperatures. Moreover, it was found that the stress intensification in the solder exposed to the triangle-shape current leads to the increase of brittle intermetallic compounds and the degradation of mechanical properties. Moreover, thermal resistivity of solder joints was considered as failure indicator and found that the triangle AC current had the significant effect on the increase of thermal resistivity in the solder joint in a certain time compared with other AC current shapes. � 2019 The Society of Manufacturing Engineers Final 2023-05-29T08:11:20Z 2023-05-29T08:11:20Z 2020 Article 10.1016/j.jmapro.2019.12.041 2-s2.0-85077392144 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85077392144&doi=10.1016%2fj.jmapro.2019.12.041&partnerID=40&md5=dfcd1d44599bfa850ca27734d58f93cf https://irepository.uniten.edu.my/handle/123456789/25588 50 450 455 All Open Access, Green Elsevier Ltd Scopus
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description Degradation; Mechanical properties; AC currents; Alternating current; Degradation of mechanical properties; Electronic package; Electronic systems; Micro-structural characterization; Solder joints; Thermal fluctuations; Electric impedance measurement
author2 42862458800
author_facet 42862458800
Siswanto W.A.
Krasnopevtsev A.Y.
Talarpoushti G.F.
Maseleno A.
Kuzichkin O.R.
format Article
author Siswanto W.A.
Krasnopevtsev A.Y.
Talarpoushti G.F.
Maseleno A.
Kuzichkin O.R.
spellingShingle Siswanto W.A.
Krasnopevtsev A.Y.
Talarpoushti G.F.
Maseleno A.
Kuzichkin O.R.
Role of alternating current shape on microstructure and damage evolution of solder joints
author_sort Siswanto W.A.
title Role of alternating current shape on microstructure and damage evolution of solder joints
title_short Role of alternating current shape on microstructure and damage evolution of solder joints
title_full Role of alternating current shape on microstructure and damage evolution of solder joints
title_fullStr Role of alternating current shape on microstructure and damage evolution of solder joints
title_full_unstemmed Role of alternating current shape on microstructure and damage evolution of solder joints
title_sort role of alternating current shape on microstructure and damage evolution of solder joints
publisher Elsevier Ltd
publishDate 2023
_version_ 1806423400505147392
score 13.211869

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