Cover Image

Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route

Master of Science in Materials Engineering

Saved in:
Bibliographic Details
Main Author: Norhayanti, Mohd Nasir
Other Authors: Norainiza, Saud, Dr.
Format: Thesis
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2017
Subjects:
Solder and soldering
Powder Metallurgy
Sintering
Soldering technology
Solders
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77984
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-77984
record_format dspace
spelling my.unimap-779842023-03-06T02:31:57Z Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route Norhayanti, Mohd Nasir Norainiza, Saud, Dr. Solder and soldering Powder Metallurgy Sintering Soldering technology Solders Master of Science in Materials Engineering The composite technology is the new approach to improve the service temperature capabilities and thermal stability of the solder joints. Low-silver Sn98.3-Ag1.0-Cu0.7 (SAC107) and Sn99.3-Cu0.7 (Sn-0.7Cu) solders were used as matrix while silicon nitride (Si3N4) with different weight fractions (0, 0.25, 0.5, 0.75 and 1.0 wt. %) were added as reinforcement particles. The solder composites were prepared by using powder metallurgy method consists of mixing, compaction and sintering via microwave assisted rapid sintering. This microwave sintering approach results in more uniform heating with cost-effective and energy efficiency. The research project was divided into two phases. The first phase involves the fabrication and characterization of electrical, thermal, microstructural and mechanical properties of the bulk composite solder. The second phase was the studies on the properties of microstructural, solderability and mechanical properties as-reflowed solder joint/interconnection. It was noted that finer and well distributed reinforcement precipitates has led to higher microhardness and slightly decreased in melting point and electrical resistivity of bulk composite solder. The wettability performance of composite solder was improved. Correspondingly, the intermetallic compound (IMC) thickness was suppressed during the soldering. The dispersion strengthening effect enhances the shear strength and the fracture surface exhibit the ductile fracture mode with rough dimple surface instead of brittle fracture mode at the interface (substrate/solder) of composite solder joints. Overall, the addition of reinforcements into lead-free solder alloy matrix has improved all the listed properties of the solder materials. 2017 2023-03-06T02:29:28Z 2023-03-06T02:29:28Z Thesis http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77984 en Universiti Malaysia Perlis (UniMAP) Universiti Malaysia Perlis (UniMAP) School of Materials Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Solder and soldering
Powder Metallurgy
Sintering
Soldering technology
Solders
spellingShingle Solder and soldering
Powder Metallurgy
Sintering
Soldering technology
Solders
Norhayanti, Mohd Nasir
Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
description Master of Science in Materials Engineering
author2 Norainiza, Saud, Dr.
author_facet Norainiza, Saud, Dr.
Norhayanti, Mohd Nasir
format Thesis
author Norhayanti, Mohd Nasir
author_sort Norhayanti, Mohd Nasir
title Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
title_short Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
title_full Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
title_fullStr Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
title_full_unstemmed Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
title_sort fabrication of sac107 and sn-0.7cu lead free composite solder reinforced with si3n4 via powder metallurgy route
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2017
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77984
_version_ 1772813067396055040
score 13.222552

Similar Items