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Study on the effect of Ca content in 4n Gold Wire for Qfn Stacked Die Package

Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.

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Bibliographic Details
Main Authors: Azman, Jalar, Saidatul Azura, Radzi, M.A. A., Hamid
Format: Working Paper
Language:English
Published: Universiti Malaysia Perlis 2010
Subjects:
Wire bonding
Ultrasonic (USG) current
QFN packaging
Ball bonding
Bonding material
Semiconductor engineering
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/7480
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spelling my.unimap-74802010-01-12T01:18:23Z Study on the effect of Ca content in 4n Gold Wire for Qfn Stacked Die Package Azman, Jalar Saidatul Azura, Radzi M.A. A., Hamid Wire bonding Ultrasonic (USG) current QFN packaging Ball bonding Bonding material Semiconductor engineering Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis. This paper discusses the effect of two similar gold wire (wire A and wire B) used mainly as a wire bonding material in packaging. Both wires with diameter of 25.4 μm were bonded using automatic wire bonder by maintaining the temperature at 200ºC. Gold is commonly used in the field of electronic manufacturing as bonding wire that connects the IC chip and circuit board. The effect of trace elements on the mechanical properties of 4N gold wire has not been widely investigated for some years despite the important of wire-bonding and the move towards fine pitch applications. Due to the element analysis, atomic percentage of Ca in wire B is higher than wire A. Pull strength increase with the increasing of the trace element. The higher pull strength of wire B could improve the yield strength, elastic modulus and recrytallization temperature. 2010-01-12T01:17:00Z 2010-01-12T01:17:00Z 2009-12-01 Working Paper p.1-5 http://hdl.handle.net/123456789/7480 en Proceedings of the Malaysian Metallurgical Conference '09 (MMC'09) Universiti Malaysia Perlis
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Wire bonding
Ultrasonic (USG) current
QFN packaging
Ball bonding
Bonding material
Semiconductor engineering
spellingShingle Wire bonding
Ultrasonic (USG) current
QFN packaging
Ball bonding
Bonding material
Semiconductor engineering
Azman, Jalar
Saidatul Azura, Radzi
M.A. A., Hamid
Study on the effect of Ca content in 4n Gold Wire for Qfn Stacked Die Package
description Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.
format Working Paper
author Azman, Jalar
Saidatul Azura, Radzi
M.A. A., Hamid
author_facet Azman, Jalar
Saidatul Azura, Radzi
M.A. A., Hamid
author_sort Azman, Jalar
title Study on the effect of Ca content in 4n Gold Wire for Qfn Stacked Die Package
title_short Study on the effect of Ca content in 4n Gold Wire for Qfn Stacked Die Package
title_full Study on the effect of Ca content in 4n Gold Wire for Qfn Stacked Die Package
title_fullStr Study on the effect of Ca content in 4n Gold Wire for Qfn Stacked Die Package
title_full_unstemmed Study on the effect of Ca content in 4n Gold Wire for Qfn Stacked Die Package
title_sort study on the effect of ca content in 4n gold wire for qfn stacked die package
publisher Universiti Malaysia Perlis
publishDate 2010
url http://dspace.unimap.edu.my/xmlui/handle/123456789/7480
_version_ 1643788836300390400
score 13.211869

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