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Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology

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Main Authors:	Siti Rahmah, Esa, Genesia, Omar, Siti Hajar, Sheikh Md Fadzullah, Kim, S. Siow, B. Abdul Rahim, B. Çoşut
其他作者:	ghazali@utem.edu.my
格式:	Article
語言:	English
出版:	Universiti Malaysia Perlis (UniMAP) 2020
主題:	Diffusion Grain size Mechanism Microstructure Sintered Ag
在線閱讀:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68696
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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