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Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology

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書誌詳細
主要な著者:	Siti Rahmah, Esa, Genesia, Omar, Siti Hajar, Sheikh Md Fadzullah, Kim, S. Siow, B. Abdul Rahim, B. Çoşut
その他の著者:	ghazali@utem.edu.my
フォーマット:	論文
言語:	English
出版事項:	Universiti Malaysia Perlis (UniMAP) 2020
主題:	Diffusion Grain size Mechanism Microstructure Sintered Ag
オンライン･アクセス:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68696
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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