Cover Image

Characterization of alignment mark to obtain reliable alignment performance in advanced lithography

Master of Science (Microelectronics)

Saved in:
Bibliographic Details
Main Author: Normah, Ahmad
Other Authors: Uda Hashim, Prof. Madya Dr.
Format: Thesis
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2019
Subjects:
Semiconductor
Microlitoghraphy
Alignment
ASML Scanner Alignment System
Alignment process
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63456
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-63456
record_format dspace
spelling my.unimap-634562019-11-29T07:24:28Z Characterization of alignment mark to obtain reliable alignment performance in advanced lithography Normah, Ahmad Uda Hashim, Prof. Madya Dr. Semiconductor Microlitoghraphy Alignment ASML Scanner Alignment System Alignment process Master of Science (Microelectronics) The continued downscaling of semiconductor fabrication has imposed increasingly tighter overlay tolerances. Such tight tolerances will require very high performance in alignment. Hence, the objective of this research to establish characterization process for alignment evaluation and to determine the robust alignment strategy for via 1 and metal 1 masking layers. This research covers four aspects, namely to find robust alignment mark for Metal 1 and Vial layer, alignment performance comparison between via mark and metal mark, alignment mark feature size effect on alignment signal, and to evaluate the new metal alignment mark performance. In order to achieve these objectives, a fractional factorial experiment with 4 parameters variation (tungsten thickness, over polish time, aluminum thickness, and final oxide thickness) and one duplicate was developed. Fifteen alignment Mark types were evaluated. Based from the characterization experiment, B2 mark with highest capability score (4979) and weighted Cpk score (75.16) is the 11I0St robust alignment mark for Metal 1 layer. A3 is the most robust alignment mark for Via 1 layer. A3 mark gives the highest total score in weighted average capability analysis (2173.52) and Cpk analysis (2800). Based on this work, contact mark is more sensitive to process variation as it pattern formation involved 6 processing steps compared to 3 steps for metal mark. For via //lark, big mark size (more than 2.6 f.1m) gives bad alignment signal quality compared to the smaller feature size. Regardless of mark size, alignment signal generates by metal mark gives comparable results. Two types of new metal alignment mark designs (B8 and B9) were evaluated in this experiment. The results were compared with standard metal mark (B6) and standard via mark (B4). B8 gives the best overall alignment and overlay performance since it gives the highest total in weighted average analysis (/40.96(alignment) and 53.43 (overlay)). The research findings becomes a baseline for C18 technology alignment process and already implemented in our production line. 2019-11-29T07:24:28Z 2019-11-29T07:24:28Z 2007 Thesis http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63456 en Universiti Malaysia Perlis (UniMAP) School of Microelectronic Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Semiconductor
Microlitoghraphy
Alignment
ASML Scanner Alignment System
Alignment process
spellingShingle Semiconductor
Microlitoghraphy
Alignment
ASML Scanner Alignment System
Alignment process
Normah, Ahmad
Characterization of alignment mark to obtain reliable alignment performance in advanced lithography
description Master of Science (Microelectronics)
author2 Uda Hashim, Prof. Madya Dr.
author_facet Uda Hashim, Prof. Madya Dr.
Normah, Ahmad
format Thesis
author Normah, Ahmad
author_sort Normah, Ahmad
title Characterization of alignment mark to obtain reliable alignment performance in advanced lithography
title_short Characterization of alignment mark to obtain reliable alignment performance in advanced lithography
title_full Characterization of alignment mark to obtain reliable alignment performance in advanced lithography
title_fullStr Characterization of alignment mark to obtain reliable alignment performance in advanced lithography
title_full_unstemmed Characterization of alignment mark to obtain reliable alignment performance in advanced lithography
title_sort characterization of alignment mark to obtain reliable alignment performance in advanced lithography
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2019
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/63456
_version_ 1651868848809312256
score 13.222552

Similar Items