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Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder

One of the leading choices in upgrading the properties of existing lead-free solder alloys is by composite technology approach, whereby high technical ceramic particles can be added into the solder alloy matrix. Accordingly, Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder was synthesized using powder meta...

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Main Author: Flora, Somidin
Other Authors: Mohd Arif Anuar Mohd Salleh
Format: Thesis
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2019
Subjects:
Sintering
Solders
Hybrid microwave
Soldering
Solder alloy
Composite technology
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/61873
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spelling my.unimap-618732019-09-14T02:30:07Z Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder Flora, Somidin Mohd Arif Anuar Mohd Salleh Sintering Solders Hybrid microwave Soldering Solder alloy Composite technology One of the leading choices in upgrading the properties of existing lead-free solder alloys is by composite technology approach, whereby high technical ceramic particles can be added into the solder alloy matrix. Accordingly, Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder was synthesized using powder metallurgy routes which consist of blending, compaction and sintering. This research introduced a hybrid microwave assisted sintering process which can sinter ceramic-reinforced composite solder at approximately 185˚C within 2 minutes without holding time and protective inert gas. In order to evaluate the compatibility of hybrid microwave assisted sintering approach in ceramic-reinforced composite solder development, a detailed comparison of the process and properties of conventionally sintered and microwave sintered samples of Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder was performed. Identical sintering temperature at 185 ˚C was used for both types of sintering, in which conventional sintering was performed using a tube furnace in an argon atmosphere for 2 hours. The monolithic Sn-0.7Cu solder sample was also synthesized as control sample in a similar way. Hybrid microwave assisted sintering method showed significant advantages in processing compared to conventional sintering method, such as rapid heating rate, shortened sintering time, less energy consumption and much less expensive equipment. The influence of different sintering methodologies on Sn-0.7Cu + 1.0wt.% Si₃N₄ bulk solder sample were investigated based on the density, porosity, microhardness, microstructures, wettability and intermetallic compound thickness on Cu-substrate. It was noted that microwave sintering method can densify the Sn-0.7Cu + 1.0wt.% Si₃N₄ composite bulk solder green compact in a short time, however, conventional sintered sample showed better density and porosity. Interestingly, finer and well-distributed precipitates were observed in microwave sintered samples. This has led to higher microhardness performance observed in microwave sintered sample (12.0 ± 0.2 HV) compared to the conventionally sintered sample (11.2 ± 0.1 HV). The wettability performance of Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder on Cu-substrate was slightly reduced with microwave sintering approach, however, insignificant difference of intermetallic compound thickness was observed in both microwave sintered and conventionally sintered samples. Overall, hybrid microwave assisted sintering showed better processing with promising properties on ceramic-reinforced Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder. 2019-09-14T02:30:07Z 2019-09-14T02:30:07Z 2015 Thesis http://dspace.unimap.edu.my:80/xmlui/handle/123456789/61873 en Universiti Malaysia Perlis (UniMAP) School of Materials Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Sintering
Solders
Hybrid microwave
Soldering
Solder alloy
Composite technology
spellingShingle Sintering
Solders
Hybrid microwave
Soldering
Solder alloy
Composite technology
Flora, Somidin
Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
description One of the leading choices in upgrading the properties of existing lead-free solder alloys is by composite technology approach, whereby high technical ceramic particles can be added into the solder alloy matrix. Accordingly, Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder was synthesized using powder metallurgy routes which consist of blending, compaction and sintering. This research introduced a hybrid microwave assisted sintering process which can sinter ceramic-reinforced composite solder at approximately 185˚C within 2 minutes without holding time and protective inert gas. In order to evaluate the compatibility of hybrid microwave assisted sintering approach in ceramic-reinforced composite solder development, a detailed comparison of the process and properties of conventionally sintered and microwave sintered samples of Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder was performed. Identical sintering temperature at 185 ˚C was used for both types of sintering, in which conventional sintering was performed using a tube furnace in an argon atmosphere for 2 hours. The monolithic Sn-0.7Cu solder sample was also synthesized as control sample in a similar way. Hybrid microwave assisted sintering method showed significant advantages in processing compared to conventional sintering method, such as rapid heating rate, shortened sintering time, less energy consumption and much less expensive equipment. The influence of different sintering methodologies on Sn-0.7Cu + 1.0wt.% Si₃N₄ bulk solder sample were investigated based on the density, porosity, microhardness, microstructures, wettability and intermetallic compound thickness on Cu-substrate. It was noted that microwave sintering method can densify the Sn-0.7Cu + 1.0wt.% Si₃N₄ composite bulk solder green compact in a short time, however, conventional sintered sample showed better density and porosity. Interestingly, finer and well-distributed precipitates were observed in microwave sintered samples. This has led to higher microhardness performance observed in microwave sintered sample (12.0 ± 0.2 HV) compared to the conventionally sintered sample (11.2 ± 0.1 HV). The wettability performance of Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder on Cu-substrate was slightly reduced with microwave sintering approach, however, insignificant difference of intermetallic compound thickness was observed in both microwave sintered and conventionally sintered samples. Overall, hybrid microwave assisted sintering showed better processing with promising properties on ceramic-reinforced Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder.
author2 Mohd Arif Anuar Mohd Salleh
author_facet Mohd Arif Anuar Mohd Salleh
Flora, Somidin
format Thesis
author Flora, Somidin
author_sort Flora, Somidin
title Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
title_short Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
title_full Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
title_fullStr Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
title_full_unstemmed Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
title_sort fabrication and characterization of hybrid microwave assisted sintering sn-0.7cu + 1.0wt.% si₃n₄ composite solder
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2019
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/61873
_version_ 1651868581576572928
score 13.222552

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