Influence of shear strength on long term biased humidity reliability of Cu ball bonds
Link to publisher's homepage at http://www.springer.com/
Saved in:
Main Authors: | Chong, Leong Gan, Uda, Hashim, Prof. Dr. |
---|---|
Other Authors: | clgan_pgg@yahoo.com |
Format: | Article |
Language: | English |
Published: |
Springer Science+Business Media New York
2015
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39431 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Extended reliability of gold and copper ball bonds in microelectronic packaging
by: Chong, Leong Gan, et al.
Published: (2014) -
Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
by: Chong, Leong Gan, et al.
Published: (2014) -
Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
by: Chong, Leong Gan, et al.
Published: (2014) -
Strength prediction and reliability of brittle epoxy adhesively bonded dissimilar joint
by: Mohd Afendi, Rojan, Dr., et al.
Published: (2014) -
A study on factors that effect bond price volatility in Malaysia bond market / Nur Hafsah Dan
by: Dan, Nur Hafsah
Published: (2011)