Cover Image

Epoxy -recycled copper (e-recop) as thermoforming mold materials

Received a Silver medal in 25th International Invention, Innovation & Technology Exhibition (ITEX'14), 8th-10th May at Kuala Lumpur Convention Centre.

Saved in:
Bibliographic Details
Main Author: Teh Pei Leng, Dr.
Format: Other
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2014
Subjects:
International Invention, Innovation & Technology Exhibition (ITEX'14)
Mold materials
Termoforming mold
Recycle copper
Low cost mold
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/36079
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-36079
record_format dspace
spelling my.unimap-360792014-07-08T03:30:23Z Epoxy -recycled copper (e-recop) as thermoforming mold materials Teh Pei Leng, Dr. International Invention, Innovation & Technology Exhibition (ITEX'14) Mold materials Termoforming mold Recycle copper Low cost mold Received a Silver medal in 25th International Invention, Innovation & Technology Exhibition (ITEX'14), 8th-10th May at Kuala Lumpur Convention Centre. • Rigidity and conductivity of metal thermoforming mold is better but it is expensive in term of fabrication process and material; E-REGOP mold is fabricated using simple, fast fabrication method. Lower material cost and it is able to fabricate in house. • Recycle copper is chosen due to its properties are almost equivalent to the virgin copper and low in cost. As compared to virgin copper, recycled copper can help in reduce the production cost of the mold material and still provide the equivalent properties as virgin copper. • Using recycled copper is more environmental friendly compared to a newly mined copper, which the mining and refining process of newly mined copper can cause pollution in the mother earth. 2014-07-08T03:30:23Z 2014-07-08T03:30:23Z 2014-05 Other http://dspace.unimap.edu.my:80/dspace/handle/123456789/36079 en 25th International Invention, Innovation & Technology Exhibition;ITEX'14 Universiti Malaysia Perlis (UniMAP) School of Materials Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic International Invention, Innovation & Technology Exhibition (ITEX'14)
Mold materials
Termoforming mold
Recycle copper
Low cost mold
spellingShingle International Invention, Innovation & Technology Exhibition (ITEX'14)
Mold materials
Termoforming mold
Recycle copper
Low cost mold
Teh Pei Leng, Dr.
Epoxy -recycled copper (e-recop) as thermoforming mold materials
description Received a Silver medal in 25th International Invention, Innovation & Technology Exhibition (ITEX'14), 8th-10th May at Kuala Lumpur Convention Centre.
format Other
author Teh Pei Leng, Dr.
author_facet Teh Pei Leng, Dr.
author_sort Teh Pei Leng, Dr.
title Epoxy -recycled copper (e-recop) as thermoforming mold materials
title_short Epoxy -recycled copper (e-recop) as thermoforming mold materials
title_full Epoxy -recycled copper (e-recop) as thermoforming mold materials
title_fullStr Epoxy -recycled copper (e-recop) as thermoforming mold materials
title_full_unstemmed Epoxy -recycled copper (e-recop) as thermoforming mold materials
title_sort epoxy -recycled copper (e-recop) as thermoforming mold materials
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/36079
_version_ 1643798005013282816
score 13.222552

Similar Items