Epoxy -recycled copper (e-recop) as thermoforming mold materials

Received a Silver medal in 25th International Invention, Innovation & Technology Exhibition (ITEX'14), 8th-10th May at Kuala Lumpur Convention Centre.

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Bibliographic Details
Main Author: Teh Pei Leng, Dr.
Format: Other
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2014
Subjects:
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/36079
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