Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
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2014
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my.unimap-348452014-05-29T02:04:11Z Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review Mohd Arif Anuar, Mohd Salleh McDonald, Stuart D. Nogita, Kazuhiro k.nogita@uq.edu.au s.mcdonald@uq.edu.au arifanuar@unimap.edu.my Intermetallic Lead-free solder Mechanical mixing Powder metallurgy Link to publisher's homepage at http://www.ttp.net/ To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. This paper reviews the fabrication processes of the lead free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that by additions of non metal reinforcement from micron up to nano particle size had suppressed the intermetallic compound formations of lead-free composite solders. 2014-05-29T01:33:40Z 2014-05-29T01:33:40Z 2013 Article Applied Mechanics and Materials, vol.421, 2013, pages 260-266 978-303785878-3 16609336 http://www.scientific.net/AMM.421.260 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34845 10.4028/www.scientific.net/AMM.421.260 en Trans Tech Publications |
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Intermetallic Lead-free solder Mechanical mixing Powder metallurgy |
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Intermetallic Lead-free solder Mechanical mixing Powder metallurgy Mohd Arif Anuar, Mohd Salleh McDonald, Stuart D. Nogita, Kazuhiro Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review |
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Link to publisher's homepage at http://www.ttp.net/ |
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k.nogita@uq.edu.au |
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k.nogita@uq.edu.au Mohd Arif Anuar, Mohd Salleh McDonald, Stuart D. Nogita, Kazuhiro |
format |
Article |
author |
Mohd Arif Anuar, Mohd Salleh McDonald, Stuart D. Nogita, Kazuhiro |
author_sort |
Mohd Arif Anuar, Mohd Salleh |
title |
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review |
title_short |
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review |
title_full |
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review |
title_fullStr |
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review |
title_full_unstemmed |
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review |
title_sort |
non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review |
publisher |
Trans Tech Publications |
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2014 |
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http://dspace.unimap.edu.my:80/dspace/handle/123456789/34845 |
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1643797616424648704 |
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13.211869 |