Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
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| Main Authors: | , , , , |
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| 格式: | Article |
| 语言: | English |
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Emerald Group Publishing Limited
2014
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| 在线阅读: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33947 |
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