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Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization

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Main Authors: Goh, Teck Joo, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Ganeshamoorthy, K. Jeevan
Other Authors: teck.joo.goh@intel.com
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2014
Subjects:
Dissipation factor
Finite element analysis
Programming and algorithm theory
Regression analysis
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33947
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spelling my.unimap-339472014-04-23T05:06:44Z Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization Goh, Teck Joo Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. Ganeshamoorthy, K. Jeevan teck.joo.goh@intel.com knseetharamu@hotmail.com gaquadir@unimap.edu.my Dissipation factor Finite element analysis Programming and algorithm theory Regression analysis Link to publisher's homepage at http://www.emeraldinsight.com/ This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources in silicon chip design layout that leads to the desired junction temperature, Tj. Key thermal parameters investigated are the heat source placement distance, level of heat dissipation, and magnitude of convection heat transfer coefficient. Finite element method (FEM) is used to investigate the effect of the key parameters. From the FEM results, a multiple linear regression model employing the least-square method is developed that relates all three parameters into a single correlation which would predict the maximum junction temperature, Tj,max. 2014-04-23T05:06:44Z 2014-04-23T05:06:44Z 2004 Article Microelectronics International, vol. 21(3), 2004, pages 29-43 1356-5362 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33947 http://dx.doi.org/10.1108/13565360410549701 http://www.emeraldinsight.com/journals.htm?articleid=1508847 en Emerald Group Publishing Limited
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Dissipation factor
Finite element analysis
Programming and algorithm theory
Regression analysis
spellingShingle Dissipation factor
Finite element analysis
Programming and algorithm theory
Regression analysis
Goh, Teck Joo
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
Ganeshamoorthy, K. Jeevan
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
description Link to publisher's homepage at http://www.emeraldinsight.com/
author2 teck.joo.goh@intel.com
author_facet teck.joo.goh@intel.com
Goh, Teck Joo
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
Ganeshamoorthy, K. Jeevan
format Article
author Goh, Teck Joo
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
Ganeshamoorthy, K. Jeevan
author_sort Goh, Teck Joo
title Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
title_short Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
title_full Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
title_fullStr Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
title_full_unstemmed Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
title_sort thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
publisher Emerald Group Publishing Limited
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33947
_version_ 1643797355416256512
score 13.222552

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