Staff View: Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application

Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application

Shrinking size and increasing functionality of IC device has induced serious thermal problem. Good thermal dissipation, light weight and easy-to-process material, such as CuSiC, is a highly potential heat spreader material to cope thermal problem. Powder metallurgy method is chosen to fabricate Cu...

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Main Author:	Chuah Run Yi
Other Authors:	Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)
Format:	Learning Object
Language:	English
Published:	Universiti Malaysia Perlis 2008
Subjects:	Milling speed > Testing Materials engineering Copper Silicone Carbide > Testing Composite materials Copper > Metallurgy
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/3374
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id	my.unimap-3374
record_format	dspace
spelling	my.unimap-33742008-11-28T01:30:37Z Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application Chuah Run Yi Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor) Milling speed -- Testing Materials engineering Copper Silicone Carbide -- Testing Composite materials Copper -- Metallurgy Shrinking size and increasing functionality of IC device has induced serious thermal problem. Good thermal dissipation, light weight and easy-to-process material, such as CuSiC, is a highly potential heat spreader material to cope thermal problem. Powder metallurgy method is chosen to fabricate CuSiC composite in this project. Fabrication of CuSiC powder starts with the mixing and milling of copper and SiC powder in different milling speed (150rpm, 200rpm, 250rpm) and time (2 hours, 5 hours, 10 hours), followed by compaction and sintering process to produce CuSiC pellets. Particle size analysis has carried out after the milling process. Results showed that by increasing the milling speed and time have reduced the powder particles size but causing agglomeration at the high milling condition. At high milling speed and time, the dimension of sintered CuSiC swell, density decrease and porosity increase. This is closely related to the morphology of the composite particles where the copper particles flattened become flakes form and agglomeration happened in the end of the milling. This inhibited good packing of powders particles. This high porosity then affected the thermal conductivity properties when the voids become a barrier to the heat conduction from one particle to another particle. 2008-11-28T01:30:37Z 2008-11-28T01:30:37Z 2008-03 Learning Object http://hdl.handle.net/123456789/3374 en Universiti Malaysia Perlis School of Materials Engineering
institution	Universiti Malaysia Perlis
building	UniMAP Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Perlis
content_source	UniMAP Library Digital Repository
url_provider	http://dspace.unimap.edu.my/
language	English
topic	Milling speed -- Testing Materials engineering Copper Silicone Carbide -- Testing Composite materials Copper -- Metallurgy
spellingShingle	Milling speed -- Testing Materials engineering Copper Silicone Carbide -- Testing Composite materials Copper -- Metallurgy Chuah Run Yi Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application
description	Shrinking size and increasing functionality of IC device has induced serious thermal problem. Good thermal dissipation, light weight and easy-to-process material, such as CuSiC, is a highly potential heat spreader material to cope thermal problem. Powder metallurgy method is chosen to fabricate CuSiC composite in this project. Fabrication of CuSiC powder starts with the mixing and milling of copper and SiC powder in different milling speed (150rpm, 200rpm, 250rpm) and time (2 hours, 5 hours, 10 hours), followed by compaction and sintering process to produce CuSiC pellets. Particle size analysis has carried out after the milling process. Results showed that by increasing the milling speed and time have reduced the powder particles size but causing agglomeration at the high milling condition. At high milling speed and time, the dimension of sintered CuSiC swell, density decrease and porosity increase. This is closely related to the morphology of the composite particles where the copper particles flattened become flakes form and agglomeration happened in the end of the milling. This inhibited good packing of powders particles. This high porosity then affected the thermal conductivity properties when the voids become a barrier to the heat conduction from one particle to another particle.
author2	Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)
author_facet	Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor) Chuah Run Yi
format	Learning Object
author	Chuah Run Yi
author_sort	Chuah Run Yi
title	Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application
title_short	Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application
title_full	Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application
title_fullStr	Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application
title_full_unstemmed	Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application
title_sort	effect of particle size and milling process on the microstructure and thermal properties of copper silicon carbide (cusic) composites for electronic packing application
publisher	Universiti Malaysia Perlis
publishDate	2008
url	http://dspace.unimap.edu.my/xmlui/handle/123456789/3374
_version_	1643787819878973440
score	13.211869

Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application

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