Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
The advancement of technology in the micro and nano electronic niche has changed the aspects of interconnection of electrical connectivity. Surface adhesion of electronic device fabrication has propelled tribology element on layers and bonding of this devices as an important element. Surface roug...
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| フォーマット: | 学位論文 |
| 言語: | English |
| 出版事項: |
Universiti Malaysia Perlis (UniMAP)
2014
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| 主題: | |
| オンライン･アクセス: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33139 |
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