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Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging

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Main Authors: Chong, Leong Gan, E., K. Ng, Bak, Lee Chan, Classe, Francis, Kwuanjai, T., Uda, Hashim, Prof. Dr.
Other Authors: clgan_pgg@yahoo.com
Format: Article
Language:English
Published: Hindawi Publishing Corporation 2014
Subjects:
Cu wires
Nanoscale device
Diffusion kinetics
Wire bonds
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33100
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spelling my.unimap-331002014-03-25T06:59:29Z Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging Chong, Leong Gan E., K. Ng Bak, Lee Chan Classe, Francis Kwuanjai, T. Uda, Hashim, Prof. Dr. clgan_pgg@yahoo.com mflim@yahoo.com gchongleong@gmail.com chong-leong.gan@spansion.com uda@unimap.edu.my Cu wires Nanoscale device Diffusion kinetics Wire bonds Link to publisher's homepage at http://www.hindawi.com/ Wearout reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the HAST (with bias) and UHAST (unbiased HAST) wearout reliability performance of Au and PdCu wires used in fine pitch BGA packages. In-depth failure analysis has been carried out to identify the failure mechanism under various wearout conditions. Intermetallic compound (IMC) diffusion constants and apparent activation energies (E aa) of both wire types were investigated after high temperature storage life test (HTSL). Au bonds were identified to have faster IMC formation, compared to slower IMC growth of PdCu. PdCu wire was found to exhibit equivalent or better wearout reliability margin compared to conventional Au wire bonds. Failure mechanisms of Au, Cu ball bonds post-HAST and UHAST tests are been proposed, and both Au and PdCu IMC diffusion kinetics and their characteristics are discussed in this paper. 2014-03-25T06:59:29Z 2014-03-25T06:59:29Z 2013 Article Journal of Nanomaterials, vol. 2013, 2013, pages 1-9 1687-4110 http://www.hindawi.com/journals/jnm/2013/486373/ http://dspace.unimap.edu.my:80/dspace/handle/123456789/33100 en Hindawi Publishing Corporation
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Cu wires
Nanoscale device
Diffusion kinetics
Wire bonds
spellingShingle Cu wires
Nanoscale device
Diffusion kinetics
Wire bonds
Chong, Leong Gan
E., K. Ng
Bak, Lee Chan
Classe, Francis
Kwuanjai, T.
Uda, Hashim, Prof. Dr.
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
description Link to publisher's homepage at http://www.hindawi.com/
author2 clgan_pgg@yahoo.com
author_facet clgan_pgg@yahoo.com
Chong, Leong Gan
E., K. Ng
Bak, Lee Chan
Classe, Francis
Kwuanjai, T.
Uda, Hashim, Prof. Dr.
format Article
author Chong, Leong Gan
E., K. Ng
Bak, Lee Chan
Classe, Francis
Kwuanjai, T.
Uda, Hashim, Prof. Dr.
author_sort Chong, Leong Gan
title Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
title_short Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
title_full Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
title_fullStr Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
title_full_unstemmed Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
title_sort wearout reliability and intermetallic compound diffusion kinetics of au and pdcu wires used in nanoscale device packaging
publisher Hindawi Publishing Corporation
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33100
_version_ 1643797067543347200
score 13.222552

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