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Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array

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Main Authors: Chong, Leong Gan, Classe, Francis, Uda, Hashim, Prof. Dr.
Other Authors: uda@unimap.edu.my
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2014
Subjects:
Apparent activation energy (Eaa)
BGA package
High temperature storage life
Lognormal plot
Long-term reliability
Reliability management
Storage
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33078
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spelling my.unimap-330782014-03-25T01:46:41Z Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array Chong, Leong Gan Classe, Francis Uda, Hashim, Prof. Dr. uda@unimap.edu.my chong-leong.gan@spansion.com Apparent activation energy (Eaa) BGA package High temperature storage life Lognormal plot Long-term reliability Reliability management Storage Link to publisher's homepage at http://www.emeraldinsight.com/ Purpose - The purpose of this paper is to provide a systematic method to perform long-term reliability assessment of gold (Au) and copper (Cu) ball bonds in fineline ball grid array package. Also with the aim to study the apparent activation energies (Eaa) and its associated wearout mechanisms of both Au and Cu wire in semiconductor device packaging. This paper discusses the influence of wire type on the long-term reliability and mechanical performance after several component reliability stress tests. Design/methodology/approach - A fineline ball grid array (FBGA) package with Cu and Au wire bonds was assembled with green molding compound and substrate. Samples are subjected for long-term high temperature storage bake test at elevated temperatures of 150°C, 175°C and 200°C. Long-term reliability plots (lognormal plots) are established and Eaa of both ball bonds are determined from Arrhenius plots. Detailed failure analysis has been conducted on failed sample and HTSL failure mechanisms have been proposed. Findings - Reliability results show Au ball bond in FBGA package is observed with higher hour-to-failure compared to Cu ball bonds. The Eaa value of high temperature storage life (HTSL) reliability for Au ball bond is lower than Cu ball bond. Typical HTSL failure mechanism of Au ball bond is induced by micro-voiding and AuAl intermetallic compound (IMC) micro-cracks while CuAl IMC micro-cracking (induced by Cl- corrosion attack and micro-cracking) caused wearout opens in Cu ball bond. These test results affirm the test-to-failure data collected is a useful method for lifetime prediction and Eaa calculation. Practical implications - The paper reveals higher reliability performance of Cu ball bond in FBGA flash memory package which can be deployed in flash memory FBGA packaging with optimised package bill of materials. Originality/value - The test-to-failure methodology is a useful technique for wearout reliability prediction and Eaa calculation. 2014-03-24T09:24:48Z 2014-03-24T09:24:48Z 2013 Article Microelectronics International, vol. 30(3), 2013, pages 169-175 1356-5362 http://www.emeraldinsight.com/journals.htm?articleid=17091648 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33078 en Emerald Group Publishing Limited
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Apparent activation energy (Eaa)
BGA package
High temperature storage life
Lognormal plot
Long-term reliability
Reliability management
Storage
spellingShingle Apparent activation energy (Eaa)
BGA package
High temperature storage life
Lognormal plot
Long-term reliability
Reliability management
Storage
Chong, Leong Gan
Classe, Francis
Uda, Hashim, Prof. Dr.
Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
description Link to publisher's homepage at http://www.emeraldinsight.com/
author2 uda@unimap.edu.my
author_facet uda@unimap.edu.my
Chong, Leong Gan
Classe, Francis
Uda, Hashim, Prof. Dr.
format Article
author Chong, Leong Gan
Classe, Francis
Uda, Hashim, Prof. Dr.
author_sort Chong, Leong Gan
title Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
title_short Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
title_full Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
title_fullStr Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
title_full_unstemmed Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
title_sort superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
publisher Emerald Group Publishing Limited
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33078
_version_ 1643797062153666560
score 13.222552

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