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Polymer core BGA stress analysis at minimal vertical loading

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Main Authors: Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Steven, Taniselass, Norazeani, Abdul Rahman, Muhamad Hafiz, Ab Aziz
Other Authors: zaliman@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
BGA
Micropearl
Ball grid array
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32660
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spelling my.unimap-326602015-03-24T04:04:50Z Polymer core BGA stress analysis at minimal vertical loading Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Steven, Taniselass Norazeani, Abdul Rahman Muhamad Hafiz, Ab Aziz zaliman@unimap.edu.my BGA Micropearl Ball grid array Link to publisher's homepage at http://www.ttp.net/ Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress response of BGA solder ball during minimum vertical loading is analyzed through simulation. The stress response between two types of solder ball, Normal BGA and Micropearl BGA are compared. The Micropearl BGA is a solder ball which contains polymer core. The vertical loading forces used were 1N and 3N. A commercial computational software ANSYS was used for the simulation. The simulation results showed that the Normal BGA exhibited higher stress response. 2014-03-13T04:03:29Z 2014-03-13T04:03:29Z 2012-12 Article Advanced Materials Research, vol.262-623, 2012, pages 639-642 1662-8985 http://dspace.unimap.edu.my:80/dspace/handle/123456789/32660 http://www.scientific.net/AMR.622-623.639 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic BGA
Micropearl
Ball grid array
spellingShingle BGA
Micropearl
Ball grid array
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Steven, Taniselass
Norazeani, Abdul Rahman
Muhamad Hafiz, Ab Aziz
Polymer core BGA stress analysis at minimal vertical loading
description Link to publisher's homepage at http://www.ttp.net/
author2 zaliman@unimap.edu.my
author_facet zaliman@unimap.edu.my
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Steven, Taniselass
Norazeani, Abdul Rahman
Muhamad Hafiz, Ab Aziz
format Article
author Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Steven, Taniselass
Norazeani, Abdul Rahman
Muhamad Hafiz, Ab Aziz
author_sort Zaliman, Sauli, Dr.
title Polymer core BGA stress analysis at minimal vertical loading
title_short Polymer core BGA stress analysis at minimal vertical loading
title_full Polymer core BGA stress analysis at minimal vertical loading
title_fullStr Polymer core BGA stress analysis at minimal vertical loading
title_full_unstemmed Polymer core BGA stress analysis at minimal vertical loading
title_sort polymer core bga stress analysis at minimal vertical loading
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/32660
_version_ 1643796945159847936
score 13.211869

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