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The effect of pulse DC and DC substrate bias during in situ cleaning PVD process on surface roughness

Malaysian Technical Universities Conference on Engineering and Technology (MUCET) 2012 organised by technical universities under the Malaysian Technical Universities Network (MTUN), 20th - 21st November 2012 at Hotel Seri Malaysia, Kangar, Perlis, Malaysia.

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Bibliographic Details
Main Authors: Hanizam, Hashim, Mohd Saufhwee, Abd Rahman, Anuar, A.R, K., Md. Nizam, Abd. Rahman, Dr., Noraiham, Mohamad, Dr.
Other Authors: hanizam@utem.edu.my
Format: Working Paper
Language:English
Published: Malaysian Technical Universities Network (MTUN) 2013
Subjects:
Physical vapor deposition
Surface roughness
Substrate bias
Pulse direct current
Tungsten carbide
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/27355
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spelling my.unimap-273552013-08-05T00:48:05Z The effect of pulse DC and DC substrate bias during in situ cleaning PVD process on surface roughness Hanizam, Hashim Mohd Saufhwee, Abd Rahman Anuar, A.R, K. Md. Nizam, Abd. Rahman, Dr. Noraiham, Mohamad, Dr. hanizam@utem.edu.my soufhwee@utem.edu.my Physical vapor deposition Surface roughness Substrate bias Pulse direct current Tungsten carbide Malaysian Technical Universities Conference on Engineering and Technology (MUCET) 2012 organised by technical universities under the Malaysian Technical Universities Network (MTUN), 20th - 21st November 2012 at Hotel Seri Malaysia, Kangar, Perlis, Malaysia. Surface morphology modification during in situ cleaning of physical vapor deposition (PVD) process is essential to strengthen and prevent unexpected adhesion failure during machining. Applying pulse direct current (PDC) on substrate bias is still uncommon compared to a conventional direct current (DC). This paper is to compare the effects of DC and PDC applied at substrate bias, to the surface roughness and homogeneity. Tungsten carbide (WC) cutting tool insert and argon were used as substrate and inert gas, respectively. The runs were conducted to compare the bias at DC (-500 V) and PDC (-200 V, -500 V, -800 V). The surface roughness and homogeneity were inspected using atomic forced microscopy (AFM) and Minitab version 16 exploited to analyze the data. The wettability based on water drop static contact angle on the substrate surface was measured by a digital 800k USB 2.0 CCD DCAM and VIS ver7 (Professional Edition) software. PDC on the substrate bias produced finer grain structures compared to DC. Further increase in PDC voltage resulted in homogenous surface with finer and more globular microstructure with higher surface energy. Hence PDC at optimum level provides better surface readiness prior to coating compared to DC and proven to be a critical factor for further enhancement of coating adhesion. 2013-08-05T00:48:05Z 2013-08-05T00:48:05Z 2012-11-20 Working Paper p. 243-247 http://hdl.handle.net/123456789/27355 en Proceedings of the Malaysian Technical Universities Conference on Engineering and Technology (MUCET) 2012 Malaysian Technical Universities Network (MTUN)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Physical vapor deposition
Surface roughness
Substrate bias
Pulse direct current
Tungsten carbide
spellingShingle Physical vapor deposition
Surface roughness
Substrate bias
Pulse direct current
Tungsten carbide
Hanizam, Hashim
Mohd Saufhwee, Abd Rahman
Anuar, A.R, K.
Md. Nizam, Abd. Rahman, Dr.
Noraiham, Mohamad, Dr.
The effect of pulse DC and DC substrate bias during in situ cleaning PVD process on surface roughness
description Malaysian Technical Universities Conference on Engineering and Technology (MUCET) 2012 organised by technical universities under the Malaysian Technical Universities Network (MTUN), 20th - 21st November 2012 at Hotel Seri Malaysia, Kangar, Perlis, Malaysia.
author2 hanizam@utem.edu.my
author_facet hanizam@utem.edu.my
Hanizam, Hashim
Mohd Saufhwee, Abd Rahman
Anuar, A.R, K.
Md. Nizam, Abd. Rahman, Dr.
Noraiham, Mohamad, Dr.
format Working Paper
author Hanizam, Hashim
Mohd Saufhwee, Abd Rahman
Anuar, A.R, K.
Md. Nizam, Abd. Rahman, Dr.
Noraiham, Mohamad, Dr.
author_sort Hanizam, Hashim
title The effect of pulse DC and DC substrate bias during in situ cleaning PVD process on surface roughness
title_short The effect of pulse DC and DC substrate bias during in situ cleaning PVD process on surface roughness
title_full The effect of pulse DC and DC substrate bias during in situ cleaning PVD process on surface roughness
title_fullStr The effect of pulse DC and DC substrate bias during in situ cleaning PVD process on surface roughness
title_full_unstemmed The effect of pulse DC and DC substrate bias during in situ cleaning PVD process on surface roughness
title_sort effect of pulse dc and dc substrate bias during in situ cleaning pvd process on surface roughness
publisher Malaysian Technical Universities Network (MTUN)
publishDate 2013
url http://dspace.unimap.edu.my/xmlui/handle/123456789/27355
_version_ 1643795234752036864
score 13.222552

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