Comments: Self-heating and substrate effects in ultra-thin body ultra-thin BOX devices

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Bibliographic Details
Main Authors:	S., Makovejev, V., Kilchytska, Mohd Khairuddin, Md Arshad, D., Flandre, F., Andrieu, O., Faynot, S., Olsen, J. P., Raskin
Format:	Working Paper
Language:	English
Published:	Institute of Electrical and Electronics Engineers (IEEE) 2011
Subjects:	Bulk silicon Ground planes Interface effect Output conductance Self-heating Substrate effects Thermal properties Ultra-thin Ultrathin body
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/14887
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