实物特征: Self-heating and substrate effects in ultra-thin body ultra-thin BOX devices

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Main Authors:	S., Makovejev, V., Kilchytska, Mohd Khairuddin, Md Arshad, D., Flandre, F., Andrieu, O., Faynot, S., Olsen, J. P., Raskin
格式:	Working Paper
语言:	English
出版:	Institute of Electrical and Electronics Engineers (IEEE) 2011
主题:	Bulk silicon Ground planes Interface effect Output conductance Self-heating Substrate effects Thermal properties Ultra-thin Ultrathin body
在线阅读:	http://dspace.unimap.edu.my/xmlui/handle/123456789/14887
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实物特征
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