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Reactive Ion Etching (RIE) Etched Wet-Silica-On-Silicon Analysis for Fluid Wettability

RIE etched wet silica-on-silicon analysis is more to surface roughness analysis which analysis on silica substrate after plasma etching especially on de-ionized water droplets testing for fluid wettability scope. The thick oxide is needed for RIE purpose and characterized the etching and surface pr...

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Bibliographic Details
Main Author: Noor Aini Hamimah Abd. Rahim
Other Authors: Prabakaran Poopalan, Assoc. Prof. Dr. (Advisor)
Format: Learning Object
Language:English
Published: Universiti Malaysia Perlis 2008
Subjects:
Silica
Reactive Ion Etching (RIE)
Silica-on-silicon analysis
Surface roughness analysis
Atomic Force Microscope
Wet-Silica-On-Silicon Analysis
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/1333
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spelling my.unimap-13332008-10-29T04:52:01Z Reactive Ion Etching (RIE) Etched Wet-Silica-On-Silicon Analysis for Fluid Wettability Noor Aini Hamimah Abd. Rahim Prabakaran Poopalan, Assoc. Prof. Dr. (Advisor) Silica Reactive Ion Etching (RIE) Silica-on-silicon analysis Surface roughness analysis Atomic Force Microscope Wet-Silica-On-Silicon Analysis RIE etched wet silica-on-silicon analysis is more to surface roughness analysis which analysis on silica substrate after plasma etching especially on de-ionized water droplets testing for fluid wettability scope. The thick oxide is needed for RIE purpose and characterized the etching and surface profile using Atomic Force Microscope. The contact angles measurement is required for the wettability analysis thus to characterized the de-ionized water droplets profile using optical inspection. This contact angles must be more than 90° for non-wetting profile or less than 90° for wetting profile. All the entire measurements angles allowed gives the silica substrate surface analysis results that related to RIE etched wet silica-on-silicon analysis. In this project, all the contact angles are wetting profile which is homogeneous types. 2008-06-27T08:31:43Z 2008-06-27T08:31:43Z 2007-03 Learning Object http://hdl.handle.net/123456789/1333 en Universiti Malaysia Perlis School of Microelectronic Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Silica
Reactive Ion Etching (RIE)
Silica-on-silicon analysis
Surface roughness analysis
Atomic Force Microscope
Wet-Silica-On-Silicon Analysis
spellingShingle Silica
Reactive Ion Etching (RIE)
Silica-on-silicon analysis
Surface roughness analysis
Atomic Force Microscope
Wet-Silica-On-Silicon Analysis
Noor Aini Hamimah Abd. Rahim
Reactive Ion Etching (RIE) Etched Wet-Silica-On-Silicon Analysis for Fluid Wettability
description RIE etched wet silica-on-silicon analysis is more to surface roughness analysis which analysis on silica substrate after plasma etching especially on de-ionized water droplets testing for fluid wettability scope. The thick oxide is needed for RIE purpose and characterized the etching and surface profile using Atomic Force Microscope. The contact angles measurement is required for the wettability analysis thus to characterized the de-ionized water droplets profile using optical inspection. This contact angles must be more than 90° for non-wetting profile or less than 90° for wetting profile. All the entire measurements angles allowed gives the silica substrate surface analysis results that related to RIE etched wet silica-on-silicon analysis. In this project, all the contact angles are wetting profile which is homogeneous types.
author2 Prabakaran Poopalan, Assoc. Prof. Dr. (Advisor)
author_facet Prabakaran Poopalan, Assoc. Prof. Dr. (Advisor)
Noor Aini Hamimah Abd. Rahim
format Learning Object
author Noor Aini Hamimah Abd. Rahim
author_sort Noor Aini Hamimah Abd. Rahim
title Reactive Ion Etching (RIE) Etched Wet-Silica-On-Silicon Analysis for Fluid Wettability
title_short Reactive Ion Etching (RIE) Etched Wet-Silica-On-Silicon Analysis for Fluid Wettability
title_full Reactive Ion Etching (RIE) Etched Wet-Silica-On-Silicon Analysis for Fluid Wettability
title_fullStr Reactive Ion Etching (RIE) Etched Wet-Silica-On-Silicon Analysis for Fluid Wettability
title_full_unstemmed Reactive Ion Etching (RIE) Etched Wet-Silica-On-Silicon Analysis for Fluid Wettability
title_sort reactive ion etching (rie) etched wet-silica-on-silicon analysis for fluid wettability
publisher Universiti Malaysia Perlis
publishDate 2008
url http://dspace.unimap.edu.my/xmlui/handle/123456789/1333
_version_ 1643787225963429888
score 13.211869

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