持有资料: Temperature cycling analysis for ball grid array package using finite element analysis

Link to publisher's homepage http://www.emeraldinsight.com/

Saved in:

书目详细资料
Main Authors:	Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Prof. Dr., Ghulam, Abdul Quadir
格式:	Article
语言:	English
出版:	Emerald Group Publishing Limited 2011
主题:	Finite element analysis Joining processes Soldering Stress (materials) Surface fitting
在线阅读:	http://dspace.unimap.edu.my/xmlui/handle/123456789/12182
标签:	添加标签没有标签, 成为第一个标记此记录!