您的評論: Temperature cycling analysis for ball grid array package using finite element analysis

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書目詳細資料
Main Authors:	Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Prof. Dr., Ghulam, Abdul Quadir
格式:	Article
語言:	English
出版:	Emerald Group Publishing Limited 2011
主題:	Finite element analysis Joining processes Soldering Stress (materials) Surface fitting
在線閱讀:	http://dspace.unimap.edu.my/xmlui/handle/123456789/12182
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