Staff View: Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix

Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix

Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the...

Full description

Saved in:

Bibliographic Details
Main Authors:	Bashir, Muhammad Nasir, Haseeb, Abdul S.Md Abdul, Wakeel, Saif, Khan, Muhammad Ali, Quazi, Moinuddin Mohammed, Khan, Niaz Bahadur, Ahmed, Arslan, Soudagar, Manzoore Elahi M.
Format:	Article
Language:	English English
Published:	Springer 2022
Subjects:	T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics
Online Access:	http://umpir.ump.edu.my/id/eprint/42710/1/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure.pdf http://umpir.ump.edu.my/id/eprint/42710/2/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure%20of%20SAC305%20solder%20matrix_ABS.pdf http://umpir.ump.edu.my/id/eprint/42710/ https://doi.org/10.1007/s10854-022-08827-0 https://doi.org/10.1007/s10854-022-08827-0
Tags:	Add Tag No Tags, Be the first to tag this record!

id	my.ump.umpir.42710
record_format	eprints
spelling	my.ump.umpir.427102025-01-07T03:54:00Z http://umpir.ump.edu.my/id/eprint/42710/ Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix Bashir, Muhammad Nasir Haseeb, Abdul S.Md Abdul Wakeel, Saif Khan, Muhammad Ali Quazi, Moinuddin Mohammed Khan, Niaz Bahadur Ahmed, Arslan Soudagar, Manzoore Elahi M. T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and β-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of β-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of β-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint. Springer 2022-09 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/42710/1/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure.pdf pdf en http://umpir.ump.edu.my/id/eprint/42710/2/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure%20of%20SAC305%20solder%20matrix_ABS.pdf Bashir, Muhammad Nasir and Haseeb, Abdul S.Md Abdul and Wakeel, Saif and Khan, Muhammad Ali and Quazi, Moinuddin Mohammed and Khan, Niaz Bahadur and Ahmed, Arslan and Soudagar, Manzoore Elahi M. (2022) Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix. Journal of Materials Science: Materials in Electronics, 33 (25). pp. 20106-20120. ISSN 0957-4522. (Published) https://doi.org/10.1007/s10854-022-08827-0 https://doi.org/10.1007/s10854-022-08827-0
institution	Universiti Malaysia Pahang Al-Sultan Abdullah
building	UMPSA Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Pahang Al-Sultan Abdullah
content_source	UMPSA Institutional Repository
url_provider	http://umpir.ump.edu.my/
language	English English
topic	T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics
spellingShingle	T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery TL Motor vehicles. Aeronautics. Astronautics Bashir, Muhammad Nasir Haseeb, Abdul S.Md Abdul Wakeel, Saif Khan, Muhammad Ali Quazi, Moinuddin Mohammed Khan, Niaz Bahadur Ahmed, Arslan Soudagar, Manzoore Elahi M. Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix
description	Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and β-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of β-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of β-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint.
format	Article
author	Bashir, Muhammad Nasir Haseeb, Abdul S.Md Abdul Wakeel, Saif Khan, Muhammad Ali Quazi, Moinuddin Mohammed Khan, Niaz Bahadur Ahmed, Arslan Soudagar, Manzoore Elahi M.
author_facet	Bashir, Muhammad Nasir Haseeb, Abdul S.Md Abdul Wakeel, Saif Khan, Muhammad Ali Quazi, Moinuddin Mohammed Khan, Niaz Bahadur Ahmed, Arslan Soudagar, Manzoore Elahi M.
author_sort	Bashir, Muhammad Nasir
title	Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix
title_short	Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix
title_full	Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix
title_fullStr	Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix
title_full_unstemmed	Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix
title_sort	effect of ni and co nanoparticle-doped ﬂux on microstructure of sac305 solder matrix
publisher	Springer
publishDate	2022
url	http://umpir.ump.edu.my/id/eprint/42710/1/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure.pdf http://umpir.ump.edu.my/id/eprint/42710/2/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure%20of%20SAC305%20solder%20matrix_ABS.pdf http://umpir.ump.edu.my/id/eprint/42710/ https://doi.org/10.1007/s10854-022-08827-0 https://doi.org/10.1007/s10854-022-08827-0
_version_	1822924879134982144
score	13.2353115

Effect of Ni and Co nanoparticle-doped ﬂux on microstructure of SAC305 solder matrix

Similar Items