Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix
Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English English |
| Published: |
Springer
2022
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/42710/1/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure.pdf http://umpir.ump.edu.my/id/eprint/42710/2/Effect%20of%20Ni%20and%20Co%20nanoparticle-doped%20flux%20on%20microstructure%20of%20SAC305%20solder%20matrix_ABS.pdf http://umpir.ump.edu.my/id/eprint/42710/ https://doi.org/10.1007/s10854-022-08827-0 https://doi.org/10.1007/s10854-022-08827-0 |
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| Summary: | Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important role in the properties of the Sn-based solder joint. In the present study, Ni and Co nanoparticle (NP)-doped flux were added into the SAC305 solder matrix to observe their effect on the microstructure of the eutectic region and β-Sn grain during the reflow process. Results reveal that after the addition of Ni and Co NP-doped flux, the size of β-Sn grain and the size of IMC particles present in the eutectic region significantly reduced. The area of the eutectic region also increased. Reduction in size of β-Sn grain and IMC particles improves the mechanical and structural properties of the solder joint. |
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