Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint
Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting poi...
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| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English English |
| Published: |
Springer
2022
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/40187/1/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical.pdf http://umpir.ump.edu.my/id/eprint/40187/2/Effects%20of%20tin%20particles%20addition%20on%20structural%20and%20mechanical%20properties%20of%20eutectic%20Sn%E2%80%9358Bi%20solder%20joint_ABS.pdf http://umpir.ump.edu.my/id/eprint/40187/ https://doi.org/10.1007/s10854-022-09028-5 https://doi.org/10.1007/s10854-022-09028-5 |
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