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Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints

Microwave hybrid heating (MHH) has become soldering’s alternative method for lead-free solder alloys due to its benefits towards modern microtechnology, such as shorter processing time, lower energy consumption and lower defect rate. Nonetheless, it still requires susceptors to improve its heating p...

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Main Authors: Siti Rabiatull Aisha, Idris, M. N., Mazelan
Format: Article
Language:English
Published: Universiti Malaysia Pahang 2023
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/38989/1/Effect%20of%20Microwave%20Hybrid%20Heating%20on%20Mechanical%20Properties.pdf
http://umpir.ump.edu.my/id/eprint/38989/
https://doi.org/10.15282/ijame.20.3.2023.15.0829
https://doi.org/10.15282/ijame.20.3.2023.15.0829
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spelling my.ump.umpir.389892023-10-24T01:13:31Z http://umpir.ump.edu.my/id/eprint/38989/ Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints Siti Rabiatull Aisha, Idris M. N., Mazelan TJ Mechanical engineering and machinery Microwave hybrid heating (MHH) has become soldering’s alternative method for lead-free solder alloys due to its benefits towards modern microtechnology, such as shorter processing time, lower energy consumption and lower defect rate. Nonetheless, it still requires susceptors to improve its heating performance, such as SiC, which is known for its high loss factor under low microwave frequencies. In this study, the effect of microwave hybrid heating on mechanical properties, as well as the microstructure of solder joint between Sn3.0Ag0.5Cu (SAC305) solder alloy and Cu substrate was investigated. Solder joint was created using MHH with different soldering parameters (amount of SiC in a range of 3-7g and exposure time in a range of 7-10min) between SAC305 solder alloy (in the form of wire and paste) and Cu substrate. Then, a lap shear test was carried out following a standard of ASTM D1002 to determine solder joint strength. Characterization was made using an optical microscope and scanning electron microscopy. Results showed that solder wire produced the highest solder joint strength with the value of 115.45 MPa when using 3.05g of SiC for 8.92min soldering time. Meanwhile, the solder paste produced 109.76MPa solder joint strength when using 3.03 g of SiC for 9.39 min soldering time. The intermetallic compound (IMC) form was scallop-like Cu6Sn5, both solder/substrate joints with a thickness of 2.87 μm for solder wire and 3.62 μm for solder paste. Nonetheless, an excessive amount of SiC would generate more heat in MHH and increase the IMC thickness as well as reduce shear strength, which eventually decreases the solder joint stability. Universiti Malaysia Pahang 2023-10 Article PeerReviewed pdf en cc_by_nc_4 http://umpir.ump.edu.my/id/eprint/38989/1/Effect%20of%20Microwave%20Hybrid%20Heating%20on%20Mechanical%20Properties.pdf Siti Rabiatull Aisha, Idris and M. N., Mazelan (2023) Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints. International Journal of Automotive and Mechanical Engineering (IJAME), 20 (3). ISSN 2229-8649 (Print); 2180-1606 (Online). (Published) https://doi.org/10.15282/ijame.20.3.2023.15.0829 https://doi.org/10.15282/ijame.20.3.2023.15.0829
institution Universiti Malaysia Pahang Al-Sultan Abdullah
building UMPSA Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang Al-Sultan Abdullah
content_source UMPSA Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Siti Rabiatull Aisha, Idris
M. N., Mazelan
Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
description Microwave hybrid heating (MHH) has become soldering’s alternative method for lead-free solder alloys due to its benefits towards modern microtechnology, such as shorter processing time, lower energy consumption and lower defect rate. Nonetheless, it still requires susceptors to improve its heating performance, such as SiC, which is known for its high loss factor under low microwave frequencies. In this study, the effect of microwave hybrid heating on mechanical properties, as well as the microstructure of solder joint between Sn3.0Ag0.5Cu (SAC305) solder alloy and Cu substrate was investigated. Solder joint was created using MHH with different soldering parameters (amount of SiC in a range of 3-7g and exposure time in a range of 7-10min) between SAC305 solder alloy (in the form of wire and paste) and Cu substrate. Then, a lap shear test was carried out following a standard of ASTM D1002 to determine solder joint strength. Characterization was made using an optical microscope and scanning electron microscopy. Results showed that solder wire produced the highest solder joint strength with the value of 115.45 MPa when using 3.05g of SiC for 8.92min soldering time. Meanwhile, the solder paste produced 109.76MPa solder joint strength when using 3.03 g of SiC for 9.39 min soldering time. The intermetallic compound (IMC) form was scallop-like Cu6Sn5, both solder/substrate joints with a thickness of 2.87 μm for solder wire and 3.62 μm for solder paste. Nonetheless, an excessive amount of SiC would generate more heat in MHH and increase the IMC thickness as well as reduce shear strength, which eventually decreases the solder joint stability.
format Article
author Siti Rabiatull Aisha, Idris
M. N., Mazelan
author_facet Siti Rabiatull Aisha, Idris
M. N., Mazelan
author_sort Siti Rabiatull Aisha, Idris
title Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
title_short Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
title_full Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
title_fullStr Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
title_full_unstemmed Effect of microwave hybrid heating on mechanical properties and microstructure of Sn3.0Ag0.5Cu/Cu solder joints
title_sort effect of microwave hybrid heating on mechanical properties and microstructure of sn3.0ag0.5cu/cu solder joints
publisher Universiti Malaysia Pahang
publishDate 2023
url http://umpir.ump.edu.my/id/eprint/38989/1/Effect%20of%20Microwave%20Hybrid%20Heating%20on%20Mechanical%20Properties.pdf
http://umpir.ump.edu.my/id/eprint/38989/
https://doi.org/10.15282/ijame.20.3.2023.15.0829
https://doi.org/10.15282/ijame.20.3.2023.15.0829
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score 13.235362

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