Effect Of Carbon Nanotube On Microstructure And Hardness Of Sn96.5Ag3.0Cu0.5 Solder For Microelectronic Packaging
This study investigated the SAC305 solder alloy’s performance after being reinforced with 0.01, 0.02, 0.03, and 0.04 wt.% of CNT. The performance of reinforced solders was evaluated based on their microstructure and hardness. The reinforced solder’s microstructure was observed using Scanning Electro...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Praise Worthy Prize
2021
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| Online Access: | http://eprints.utem.edu.my/id/eprint/25800/2/20148-46563-1-PB.PDF http://eprints.utem.edu.my/id/eprint/25800/ https://www.praiseworthyprize.org/jsm/index.php?journal=ireme&page=article&op=view&path[]=25422 |
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