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Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers

The reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/...

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Main Authors: Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman, Siti Rabiatull Aisha, Idris
Format: Article
Language:English
Published: Universiti Malaysia Pahang 2013
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://umpir.ump.edu.my/id/eprint/10991/1/22_Azmah%20Hanim%20et%20al.pdf
http://umpir.ump.edu.my/id/eprint/10991/
http://dx.doi.org/10.15282/ijame.8.2013.22.0110
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spelling my.ump.umpir.109912018-01-11T08:19:37Z http://umpir.ump.edu.my/id/eprint/10991/ Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers Azmah Hanim, Mohamad Ariff Ourdjini, Ali Saliza Azlina, Osman Siti Rabiatull Aisha, Idris TJ Mechanical engineering and machinery The reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/Au) surface finish were studied. The parameters include the solder type, thickness of the nickel layer and aging time. The results are focused on the type of intermetallic compound formed and the intermetallic thickness. Overall, aging changed the intermetallic morphology to become rounder, bigger and more compact with time. Aged Sn-4Ag-0.5Cu solders on Ni/Au exhibit the tendency for the intermetallic to change from (Cu,Ni)6Sn5 to (Ni,Cu)3Sn4 and finally Ni3Sn4. The results also showed that, with the parameters used in this experiment, a nickel thickness of 3µm is adequate to be a good diffusion barrier up to 2000 hours aging time. In Sn-37Pb, redeposition of (Au,Ni)Sn4 intermetallic starts after 500 hours until 2000 hours. Universiti Malaysia Pahang 2013 Article PeerReviewed application/pdf en cc_by http://umpir.ump.edu.my/id/eprint/10991/1/22_Azmah%20Hanim%20et%20al.pdf Azmah Hanim, Mohamad Ariff and Ourdjini, Ali and Saliza Azlina, Osman and Siti Rabiatull Aisha, Idris (2013) Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers. International Journal of Automotive and Mechanical Engineering (IJAME), 8. pp. 1348-1356. ISSN 1985-9325(Print); 2180-1606 (Online) http://dx.doi.org/10.15282/ijame.8.2013.22.0110 DOI: 10.15282/ijame.8.2013.22.0110
institution Universiti Malaysia Pahang
building UMP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang
content_source UMP Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Azmah Hanim, Mohamad Ariff
Ourdjini, Ali
Saliza Azlina, Osman
Siti Rabiatull Aisha, Idris
Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
description The reliability of a solder joint is closely related to the intermetallic compound formation during the joining process and its evolution after exposure to heat. Throughout this paper, interfacial reactions between Sn-4Ag-0.5Cu solders and Sn-37Pb solders with electroless nickel immersion gold (Ni/Au) surface finish were studied. The parameters include the solder type, thickness of the nickel layer and aging time. The results are focused on the type of intermetallic compound formed and the intermetallic thickness. Overall, aging changed the intermetallic morphology to become rounder, bigger and more compact with time. Aged Sn-4Ag-0.5Cu solders on Ni/Au exhibit the tendency for the intermetallic to change from (Cu,Ni)6Sn5 to (Ni,Cu)3Sn4 and finally Ni3Sn4. The results also showed that, with the parameters used in this experiment, a nickel thickness of 3µm is adequate to be a good diffusion barrier up to 2000 hours aging time. In Sn-37Pb, redeposition of (Au,Ni)Sn4 intermetallic starts after 500 hours until 2000 hours.
format Article
author Azmah Hanim, Mohamad Ariff
Ourdjini, Ali
Saliza Azlina, Osman
Siti Rabiatull Aisha, Idris
author_facet Azmah Hanim, Mohamad Ariff
Ourdjini, Ali
Saliza Azlina, Osman
Siti Rabiatull Aisha, Idris
author_sort Azmah Hanim, Mohamad Ariff
title Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
title_short Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
title_full Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
title_fullStr Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
title_full_unstemmed Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers
title_sort intermetallic evolution for isothermal aging up to 2000 hours on sn-4ag-0.5cu and sn-37pb solders with ni/au layers
publisher Universiti Malaysia Pahang
publishDate 2013
url http://umpir.ump.edu.my/id/eprint/10991/1/22_Azmah%20Hanim%20et%20al.pdf
http://umpir.ump.edu.my/id/eprint/10991/
http://dx.doi.org/10.15282/ijame.8.2013.22.0110
_version_ 1643666547505364992
score 13.211869

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