Cover Image

The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT

This paper presents the effect of gap between Plastic Leaded Chip Carrier (PLCC) by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for twomicroprocessors arran...

Full description

Saved in:
Bibliographic Details
Main Authors: Mazlan Mohamed, Anizah Kalam, Huck-Soo Loo, A.M. Mustafa Al Bakri, M.S. Abdul Aziz, C.Y. Khor, Mohammad Amizi Ayob, Mohd Sukhairi Mat Rasat
Format: Non-Indexed Article
Online Access:http://discol.umk.edu.my/id/eprint/7900/
http://www.aensiweb.com/aeb/2013/3843-3849.pdf
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.umk.eprints.7900
record_format eprints
spelling my.umk.eprints.79002022-05-23T10:23:59Z http://discol.umk.edu.my/id/eprint/7900/ The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT Mazlan Mohamed Anizah Kalam Huck-Soo Loo A.M. Mustafa Al Bakri M.S. Abdul Aziz C.Y. Khor Mohammad Amizi Ayob Mohd Sukhairi Mat Rasat This paper presents the effect of gap between Plastic Leaded Chip Carrier (PLCC) by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for twomicroprocessors arranged in line under different types of inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature and thermal resistance of each package. The junction temperature is been observed and it was found that the junction temperature of the microprocessors is not exceed 70º C. It also found that the gap between PLCC play important rolesto control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent. Non-Indexed Article NonPeerReviewed Mazlan Mohamed and Anizah Kalam and Huck-Soo Loo and A.M. Mustafa Al Bakri and M.S. Abdul Aziz and C.Y. Khor and Mohammad Amizi Ayob and Mohd Sukhairi Mat Rasat The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT. Advances in Environmental Biology, 7 (12). pp. 3843-3849. ISSN 1995-0756 http://www.aensiweb.com/aeb/2013/3843-3849.pdf
institution Universiti Malaysia Kelantan
building Perpustakaan Universiti Malaysia Kelantan
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Kelantan
content_source UMK Institutional Repository
url_provider http://umkeprints.umk.edu.my/
description This paper presents the effect of gap between Plastic Leaded Chip Carrier (PLCC) by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for twomicroprocessors arranged in line under different types of inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature and thermal resistance of each package. The junction temperature is been observed and it was found that the junction temperature of the microprocessors is not exceed 70º C. It also found that the gap between PLCC play important rolesto control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent.
format Non-Indexed Article
author Mazlan Mohamed
Anizah Kalam
Huck-Soo Loo
A.M. Mustafa Al Bakri
M.S. Abdul Aziz
C.Y. Khor
Mohammad Amizi Ayob
Mohd Sukhairi Mat Rasat
spellingShingle Mazlan Mohamed
Anizah Kalam
Huck-Soo Loo
A.M. Mustafa Al Bakri
M.S. Abdul Aziz
C.Y. Khor
Mohammad Amizi Ayob
Mohd Sukhairi Mat Rasat
The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT
author_facet Mazlan Mohamed
Anizah Kalam
Huck-Soo Loo
A.M. Mustafa Al Bakri
M.S. Abdul Aziz
C.Y. Khor
Mohammad Amizi Ayob
Mohd Sukhairi Mat Rasat
author_sort Mazlan Mohamed
title The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT
title_short The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT
title_full The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT
title_fullStr The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT
title_full_unstemmed The effect of gap between plastic leaded chip carrier (PLCC) using Computational Fluid Dynamic (CFD) Software, FLUENT
title_sort effect of gap between plastic leaded chip carrier (plcc) using computational fluid dynamic (cfd) software, fluent
url http://discol.umk.edu.my/id/eprint/7900/
http://www.aensiweb.com/aeb/2013/3843-3849.pdf
_version_ 1763303906925871104
score 13.211869

Similar Items