Optimisation of electroplating parameters and surface defect analysis / Logapriya Logamaintan
Silver is a well-established metal used for coatings in various industries mainly in surface finishing of jewelries and decorative items. The coatings deposited on surface of substrate has to be smooth and even to ensure the coating deposited serves its purpose. There are various electroplating p...
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| Format: | Thesis |
| Published: |
2019
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/11300/1/Logapriya_Logamaintan.jpg http://studentsrepo.um.edu.my/11300/8/logapriya.pdf http://studentsrepo.um.edu.my/11300/ |
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| Summary: | Silver is a well-established metal used for coatings in various industries mainly in
surface finishing of jewelries and decorative items. The coatings deposited on surface of
substrate has to be smooth and even to ensure the coating deposited serves its purpose.
There are various electroplating parameters that affect the surface roughness and surface
defects of electroplated substrates. Therefore, this research is aimed to obtain the
optimum parameters namely current density and plating time of silver cyanide
electroplating process for bonded porcelain items produced in Royal Selangor. The
optimisation was done by varying the current density and plating time using the Taguchi
model to obtain the range of parameters for this study. The plated substrates were
evaluated for surface roughness, coating thickness and adhesiveness accordingly. From
the analysis done, as the current density and plating time increases, the surface roughness
of the substrate surface increases due to increasing nucleation rate. This can be correlated
with the surface roughness result and coating thickness images obtained from SEM
whereby the coating thickness was also found to increase along with the increasing
current density and plating time. Based on the results obtained from this study, it was
found that the optimum current density was at 4A and plating time of 3 hours for the
silver cyanide electroplating bath in Royal Selangor International. |
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